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    Title :

    Misaligned (or Twist) Wafer-Bonding: A New Technology for Making III-V Compliant Substrates



    Conference:

    Annual meeting; 9th, IEEE: Lasers and Electro-Optics Society; LEOS '96; 9th annual meeting ; 1996 ; Boston; MA



    Publication date :

    1996-01-01


    Size :

    2 pages


    Remarks:

    Described as proceedings. IEEE cat no: 96CH35895



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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