Misaligned (or Twist) Wafer-Bonding: A New Technology for Making III-V Compliant Substrates
Annual meeting; 9th, IEEE: Lasers and Electro-Optics Society; LEOS '96; 9th annual meeting ; 1996 ; Boston; MA
1996-01-01
2 pages
Described as proceedings. IEEE cat no: 96CH35895
Conference paper
English
LEOS , lasers , IEEE , electro-optics
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