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    Titel :

    Misaligned (or Twist) Wafer-Bonding: A New Technology for Making III-V Compliant Substrates



    Kongress:

    Annual meeting; 9th, IEEE: Lasers and Electro-Optics Society; LEOS '96; 9th annual meeting ; 1996 ; Boston; MA



    Erscheinungsdatum :

    1996-01-01


    Format / Umfang :

    2 pages


    Anmerkungen:

    Described as proceedings. IEEE cat no: 96CH35895



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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