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    Title :

    Monitoring Adhesive Bond Integrity with Electrochemical Impedance Spectroscopy


    Contributors:

    Conference:

    International symposium; 41st, Society for the Advancement of Material and Process Engineering ; 1996 ; Anaheim; CA



    Publication date :

    1996-01-01


    Size :

    9 pages


    Remarks:

    Book 1 of 2 books rec'd only. Theme title: Materials and process challenges: aging systems, affordability and alternative applications




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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