Access

    Access via TIB

    Check availability in my library


    Export, share and cite



    Title :

    Thermal Contact Conductance of Coated Junctions within Microelectronic Packages


    Contributors:

    Conference:

    28th Conference, Thermophysics ; 1993 ; Orlando; FL



    Publication date :

    1993-01-01


    Size :

    AIAA 93-2774


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Thermal contact conductance of coated junctions within microelectronic packages

    CHUNG, KEE-CHIANG / BENSON, HEATHER / SHEFFIELD, JOHN | AIAA | 1993


    Enhancement of thermal contact conductance of coated junctions

    Chung, Kee-Chiang / Sheffield, John W. | AIAA | 1995


    Thermal Contact Conductance of Adhesives for Microelectronic Systems

    S. R. Mirmira / E. E. Marotta / L. S. Fletcher | AIAA | 1997


    Thermal contact conductance of adhesives for microelectronic systems

    Mirmira, S. / Marotta, E. / Fletcher, L. | AIAA | 1996