1–20 von 52 Ergebnissen
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    Bayesian techniques to reduce the sample size in automotive electronics attribute testing

    Kleyner, A. / Bhagath, S. / Gasparini, M. et al. | Tema Archiv | 1997

    On-chip reliability investigations on power modules actually working in inverter systems

    Franke, T. / Honsberg-Riedl, M. / Simon, P. et al. | Tema Archiv | 1998

    Strain depending reliability of automotive diodes

    Galateanu, L. / Stoica, M.G. / Popa, E. | Tema Archiv | 1998

    Ball grid array reliability assessment for aerospace applications

    Ghaffarian, R. / Kim, N.P. | Tema Archiv | 1999

    Long term reliability testing of HV-IGBT modules in worst case traction operation

    Fratelli, L. / Cascone, B. / Giannini, G. et al. | Tema Archiv | 1999

    An assessment of the value of added screening of electronic components for commercial aerospace applications

    Hester, K.D. / Koehler, M.P. / Kanciak-Chwialkowski, H. et al. | Tema Archiv | 2001

    Reliability of MEMS - a methodical approach

    Muller-Fiedler, R. / Wagner, U. / Bernhard, W. | Tema Archiv | 2002

    Reliable power electronics for automotive applications

    Seliger, N. / Wolfgang, E. / Lefranc, G. et al. | Tema Archiv | 2002

    High temperature reliability testing of aluminum and tantalum electrolytic capacitors

    Dehbi, A. / Wondrak, W. / Ousten, Y. et al. | Tema Archiv | 2002

    Reliability aspects of semiconductor devices in high temperature applications

    Kanert, W. / Dettmer, H. / Plikat, B. et al. | Tema Archiv | 2003

    Semiconductors in high temperature applications - a future trend in automotive industry

    Goroll, M. / Pufall, R. / Kanert, W. et al. | Tema Archiv | 2004

    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archiv | 2005

    Failure mechanisms and qualification testing of passive components

    Post, H.A. / Letullier, P. / Briolat, T. et al. | Tema Archiv | 2005