Semiconductors for high temperature become increasingly important for automotive applications. Typical junction temperatures of 150 degrees C (microcontrollers)/200 degrees C (power devices) are requested. To fulfil failure rates of <1ppm in automotive applications a lot of investigations result in the following consequences: new design libraries, test concepts, technology and product qualification strategies. In the paper, the effort for semiconductor supplier to be able to provide devices for high temperature applications is presented. Investigations to assure safe high temperature device operation advanced by a European funding project are introduced. A qualification concept proposal regarding AEC-Q100 is discussed.
Semiconductors in high temperature applications - a future trend in automotive industry
ESREF, European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, 15 ; 1413-1417
Microelectronics Reliability ; 44 , 9-11
2004
5 Seiten, 7 Quellen
Aufsatz (Konferenz)
Englisch
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