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integrierte Schaltung
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keywords:(integrierte Schaltung)
Robustheit nanoelektronischer Schaltungen und Systeme
Fast Local Scrubbing for Field-Programmable Gate Array's Configuration Memory
Fast and efficient methods for circuit-based automotive EMC simulation
Thermal analysis of a high density TMOS used in an automotive solide-state relay
Environmental Conditions for Cockpit and Cabin Crew Members during Lon-Haul Flights
Leveraging the Openness and Modularity of RISC-V in Space
Small Spacecraft Software Modeling: A Petri Net-Based Approach
Radiation-Induced Noise Resilience of Neuromorphic Architectures
Effect of friction modifiers on wheel/rail isolation
Benchmarking Analysis of Space-Grade Central Processing Units and Field-Programmable Gate Arrays
Simulation of electric drive system faults in hybrid electric vehicles
Cell-Based Architecture for Adaptive Wiring Panels: A First Prototype
High-Performance Embedded Computing in Space: Evaluation of Platforms for Vision-Based Navigation
Scalable Open-Source Architecture for Real-Time Monitoring of Adaptive Wiring Panels
Assessment of need for solder in modeling potted electronics during gun-shot
Über den Einsatz von hochintegrierten Magnetfeldsensoren im Antriebsstrang
Nur die härtesten Schaltkreise dürfen ins All
An On-Chip Power Supply Regulator to Reduce the Switching Noise
An integrated chassis controller for automotive vehicle emulation
A simple computational electromagnetic analysis example of electromagnetic coupling to pyro circuits
The Influence of Knowledge Accumulation on Buyer-Supplier Codevelopment Projects
Parameter optimization of hall effect gear tooth speed sensors
Acceptance checking methods for UHF electronic components
Eine neue Fehlertoleranzmethode zur Verringerung des Flächenaufwandes von TMR-Systemen
6H-SiC transistor integrated circuits demonstrating prolonged operation at 500 deg C
Intelligent control for vibration reduction and falling-forward prevention of forklift
Dispersion and the worst case of thermal fatigue life of solder joints in vehicle electronic devices
Effect of post-mold curing of epoxy molding compound on wirebond reliability in a MOSFET
Board-level characterization of 1.0 and 1.27 mm pitch PBGA for automotive under-hood applications
Thermal characterisation and heat transfer analysis of a wire bond chip-on-board package