51–100 von 202 Ergebnissen
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    Optimization of a Copper Pattern Plating Process with Planned Experimentation and Response Surface

    Poon, G. K. K. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A DECOMPOSITION METHODOLOGY FOR SCHEDULING SEMICONDUCTOR TEST OPERATIONS FOR NUMBER OF TARDY JOB MEASURES

    Yoo, Wook-Sung | Online Contents | 1997
    Verlag: World Scientific , Singapore

    REWORK OF BGA COMPONENTS

    Chung, C. W. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    The Limits of Automating Electronic Component Rework

    Geren, N. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    On Improving the Performance of Hard Disk Drive Final Assembly via Knowledge Intensive Simulation

    Zhao, Z. Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Hygrothermal Reliability Evaluation of Plastic IC Packages with Computer-Aided Engineering Tools

    Kuo, A.-Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Analyzing the Natural Resting Aspects of Plastic Parts in a Vibratory Bowl Feeder

    Ngoi, B. K. A. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    A Study of Solderability and Solder Spreading for SMT Open Joints

    Teo, K. C. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    TECHNOLOGY TRENDS IN ELECTRONICS AND PHOTONICS, THEIR MODELING AND EFFECT ON MANUFACTURING AND ASSEMBLY

    Williams, D. J. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY

    Ramsey, B. J. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Adhesive Flip Chip Bonding on Flexible Substrates

    Aschenbrenner, R. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Thermal Model of a Component Package for System Level Applications

    Teng, S. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Pan Asian Electronic Business '94

    Souza, R. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Computer simulation of solder paste flow, part II : Flow out of a stencil aperture

    Mannan, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Application of ink screening models to solder paste printing in SMT assembly

    Mannan, S. H. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Analysis of Underfill Encapsulation Curing Deformations on Flip Chip on Boaxd (FCOB) Package Reliability

    Pang, J. H. L. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    PCB Assembly Line Setup Optimization Using Component Commonality Matrices

    Dillon, S. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Manufacturing Analysis of Underfill Processing for Low-Cost Flip Chip Assembly

    Baldwin, D. F. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    A Computational Model for Forced Convection Cooling in Electronic Components

    Olivos, T. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A Review of PCB Design for In-Circuit Testability Guidelines and Systems

    Gallagher, C. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Electric Properties of Connections by Anisotropic Conductive Film

    Shiozawa, N. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    An intelligent decision support environment for PCB assembly

    Soon, Chong Chin | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Implementation of a decision support system for scheduling semiconductor test operations

    Lee, Chung-Yee | Online Contents | 1993
    Verlag: World Scientific , Singapore

    The Performance of Vibrating Squeegee in the Stencil Printing of Solder Pastes

    Ekere, N. N. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Application of Polymer-Thick-Film-Technology (PTF) for Environmentally Friendly Electronic Devices

    Fischer, T. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    An Efficient Assembly Sequencing Heuristic for Printed Circuit Board Configurations

    Moyer, L. K. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Thermal Management for the Robustness Improvement of Double Sided SMT Solder Reflow

    Lee, N. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Comprehensive Review of Natural and Mixed Convection Heat Transfer Models for Circuit Board Arrays

    Teerstra, P. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Parameter Interactions in Stencil Printing of Solder Paste

    Haslehurst, L. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    THERMAL DISSIPATION CHARACTERISTICS OF A TAPE AUTOMATED BONDING ELECTRONIC PACKAGE

    Yang, L. Y. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A REVIEW ON DIRECT LIQUID COOLING CHANNEL FLOW WITH SINGLE-PHASE FOR ELECTRONIC SYSTEMS

    Xu, G. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A Review on Cooling by Channel Flow Boiling for Electronic Systems

    Xu, G. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    FLOW MODELING OF PQFP DURING TRANSFER MOLDING

    Kuah, T. H. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    EXPERIMENTAL STUDY OF SOLDER JOINT RELIABILITY IN A 256 PIN, 0.4 MM PITCH PQFP

    Yeo, C. K. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Adhesive Flip Chip Bonding in a Miniaturized Spectrometer

    Rusanen, O. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime

    Lee, T.-Y. T. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    SMT Feeder Slot Assignment for Predetermined Component Placement Paths

    Moyer, L. K. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Simultaneous Component Sequencing and Feeder Assignment for High Speed Chip Shooter Machines

    Moyer, L. K. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A Simulation of Evaporating Meniscus-Driven Flow for Application to Electronics Cooling Design

    Tso, C. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Statistical Process Control for Test and Scan Processes at Final Test Operation of an Integrated Circuit

    Kumar, S. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    The Solderability Evaluation of Surface Mount Components Through the Use of Wetting Balance Analysis

    Huang, C.-Y. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Book Review: Conductive Adhesives in Electronics Packaging (J. Liu)

    Ruf, C. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Laser Removal of Flux Residue Before Chip Attachment to Board in a Flip Chip Assembly

    Lu, J. C. | Online Contents | 1998
    Verlag: World Scientific , Singapore