Optimization of a Copper Pattern Plating Process with Planned Experimentation and Response Surface
The Limits of Automating Electronic Component Rework
On Improving the Performance of Hard Disk Drive Final Assembly via Knowledge Intensive Simulation
Hygrothermal Reliability Evaluation of Plastic IC Packages with Computer-Aided Engineering Tools
Analyzing the Natural Resting Aspects of Plastic Parts in a Vibratory Bowl Feeder
A Study of Solderability and Solder Spreading for SMT Open Joints
A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY
Adhesive Flip Chip Bonding on Flexible Substrates
Thermal Model of a Component Package for System Level Applications
Computer simulation of solder paste flow, part II : Flow out of a stencil aperture
Application of ink screening models to solder paste printing in SMT assembly
PCB Assembly Line Setup Optimization Using Component Commonality Matrices
Manufacturing Analysis of Underfill Processing for Low-Cost Flip Chip Assembly
A Computational Model for Forced Convection Cooling in Electronic Components
A Review of PCB Design for In-Circuit Testability Guidelines and Systems
Electric Properties of Connections by Anisotropic Conductive Film
An intelligent decision support environment for PCB assembly
Implementation of a decision support system for scheduling semiconductor test operations
The Performance of Vibrating Squeegee in the Stencil Printing of Solder Pastes
Application of Polymer-Thick-Film-Technology (PTF) for Environmentally Friendly Electronic Devices
An Efficient Assembly Sequencing Heuristic for Printed Circuit Board Configurations
Thermal Management for the Robustness Improvement of Double Sided SMT Solder Reflow
Comprehensive Review of Natural and Mixed Convection Heat Transfer Models for Circuit Board Arrays
Parameter Interactions in Stencil Printing of Solder Paste
THERMAL DISSIPATION CHARACTERISTICS OF A TAPE AUTOMATED BONDING ELECTRONIC PACKAGE
A REVIEW ON DIRECT LIQUID COOLING CHANNEL FLOW WITH SINGLE-PHASE FOR ELECTRONIC SYSTEMS
A Review on Cooling by Channel Flow Boiling for Electronic Systems
FLOW MODELING OF PQFP DURING TRANSFER MOLDING
EXPERIMENTAL STUDY OF SOLDER JOINT RELIABILITY IN A 256 PIN, 0.4 MM PITCH PQFP
Adhesive Flip Chip Bonding in a Miniaturized Spectrometer
Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime
SMT Feeder Slot Assignment for Predetermined Component Placement Paths
Simultaneous Component Sequencing and Feeder Assignment for High Speed Chip Shooter Machines
A Simulation of Evaporating Meniscus-Driven Flow for Application to Electronics Cooling Design
The Solderability Evaluation of Surface Mount Components Through the Use of Wetting Balance Analysis
Book Review: Conductive Adhesives in Electronics Packaging (J. Liu)
Laser Removal of Flux Residue Before Chip Attachment to Board in a Flip Chip Assembly