Book Review: Conductive Adhesives in Electronics Packaging (J. Liu)
Journal of electronics manufacturing ; 8 , 3-4
1998
Aufsatz (Zeitschrift)
Englisch
ELECTRICAL CONDUCTION MODELS FOR ISOTROPICALLY CONDUCTIVE ADHESIVES
Online Contents | 1995
|Optoelectronic Packaging [Book Review]
IEEE | 1997
|Optoelectronic packaging [Book Review]
IEEE | 2001
|Joining of displays using thermosetting anisotropically conductive adhesives
Online Contents | 1993
|Electrical Properties of Solder Filled Anisotropically Conductive Adhesives
Online Contents | 1995
|