Synonyme wurden verwendet für: encapsulation
Suche ohne Synonyme: keywords:(encapsulation)

1–50 von 72 Ergebnissen
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    Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests

    Corazza, Michael / Krebs, Frederik C. / Gevorgyan, Suren A. | Tema Archiv | 2014
    Schlagwörter: Verkapseln

    Innovative vibro-acoustic metamaterials to provide lightweight NVH solutions

    Claeys, Claus / Pluymers, Bert / Desmet, Wim | Tema Archiv | 2014
    Schlagwörter: Einkapselung

    Thesound reduction index applied to automotive problems

    Duvigneau, Fabian / Gabbert, Ulrich | Tema Archiv | 2014
    Schlagwörter: Einkapselung

    Jet Blast Resistance Experiment of Engineered Material Arresting System

    Xiao, Xian-Bo / Kong, Xiang-Jun / Shi, Ya-Jie et al. | Tema Archiv | 2013
    Schlagwörter: Einkapselung

    Development and testing of bio-inspired microelectromechanical pressure sensor arrays for increased situational awareness for marine vehicles

    Dusek, J. / Kottapalli, A.G.P. / Woo, M.E. et al. | Tema Archiv | 2013
    Schlagwörter: Einkapselung

    Acoustic benchmark of different CO2 encapsulation strategies: Application examples and methods for the design of powertrain encapsulations

    Bertolini, C. / Caprioli, D. / Horak, J. et al. | Tema Archiv | 2013
    Schlagwörter: Einkapselung

    Heat transfer and thermal management of electric vehicle batteries with phase change materials

    Ramandi, M.Y. / Dincer, I. / Naterer, G.F. | Tema Archiv | 2011
    Schlagwörter: Kapselung

    High density packaging for automotive applications

    Sommer, J.P. / Michel, B. / Hofmann, Th et al. | Tema Archiv | 2011
    Schlagwörter: Chip-Größen-Kapselung

    Stability of spore-based biosensing systems under extreme conditions

    Sangal, Abhishek / Pasini, Patrizia / Daunert, Sylvia | Tema Archiv | 2011
    Schlagwörter: Kapselung

    A Novel Technology for Thermal Control for ISP module for Space Applications

    Monti, Riccardo / Barboni, Renato / Gasbarri, Paolo et al. | Tema Archiv | 2010
    Schlagwörter: Wärmehaushalt (Kapselung)

    Capping technologies for MEMS

    Hausnear, R. / Stahl, H. | Tema Archiv | 2010
    Schlagwörter: Einkapselung

    New method to determine the range of DVB-H networks and the influence of MPE-FEC rate and modulation scheme

    Plets, David / Joseph, Wout / Verloock, Leen et al. | Tema Archiv | 2009
    Schlagwörter: MPE (multiprotocol encapsulation)

    MEMS package in a harsh environment for aeronautic applications

    Friedberger, Alois / Gradolph, Christian / Klettner, Florian et al. | Tema Archiv | 2008
    Schlagwörter: Verkapseln

    Test method for availability of holes in height - temperature barrier on cementation process

    Valentin Tcenev, I. / Fillipov, F. | Tema Archiv | 2007
    Schlagwörter: Wärmehaushalt (Kapselung)

    High efficiency, high reliability 2 kW inverter for aeronautical application

    Vieillard, S. / Meuret, R. | Tema Archiv | 2007
    Schlagwörter: Wärmehaushalt (Kapselung)

    A study of chip top delamination in plastic encapsulated packages under temperature loading

    Kravchenko, G. / Bohm, C. | Tema Archiv | 2007
    Schlagwörter: Verkapseln

    Metal-enclosed, air-insulated traction switchgear - developments and applications

    Lönard, Detlef / Northe, Jens | Tema Archiv | 2006
    Schlagwörter: Kapselung

    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archiv | 2005
    Schlagwörter: Verkapseln

    Thermal characterization of a mercury arc lamp for a projection display system

    Bush, B. / Li, Shu / Kelley, D. | Tema Archiv | 2004
    Schlagwörter: Wärmehaushalt (Kapselung)

    Maximizing lumen output of LEDs for automotive exterior signal lighting applications

    Conn, L.G. | Tema Archiv | 2003
    Schlagwörter: Wärmehaushalt (Kapselung)

    TPE-Glasumspritzung von Fahrzeugen, TPE-glass encapsulation

    Creusen, M. | Tema Archiv | 2003
    Schlagwörter: Einkapselung

    New development of a wet brake system

    Nowak, S. | Tema Archiv | 2002
    Schlagwörter: Verkapseln

    Enabling technologies for integrated system-on-a-package for the next generation aerospace applications

    Young, J.J. / Malshe, A.P. / Brown, W.D. et al. | Tema Archiv | 2002
    Schlagwörter: Wärmehaushalt (Kapselung)

    Titanium armor applications in combat vehicles

    Montgomery, J.S. / Wells, M.G.H. | Tema Archiv | 2001
    Schlagwörter: Verkapseln

    Optimized cooling systems for high-power semiconductor devices

    Baumann, H. / Heinemeyer, P. / Staiger, W. et al. | Tema Archiv | 2001
    Schlagwörter: Wärmehaushalt (Kapselung)

    Novel composites for space microelectronics and optics

    Kowbel, W. / Champion, W. / Oliver, P. et al. | Tema Archiv | 2001
    Schlagwörter: Wärmehaushalt (Kapselung)

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archiv | 2001
    Schlagwörter: Chip-Größen-Kapselung

    Accelerated testing of flip chip packages under dynamic load

    Rau, I. / Miessner, R. / Liebing, G. et al. | Tema Archiv | 2001
    Schlagwörter: Flip-Chip-Verkapselung

    Variable emissivity through MEMS technology

    Garrison Darrin, A. / Osiander, R. / Champion, J. et al. | Tema Archiv | 2000
    Schlagwörter: Wärmehaushalt (Kapselung)

    Acceleration threshold switches from an additive electroplating MEMS process

    Michaelis, S. / Timme, H.J. / Wycisk, M. et al. | Tema Archiv | 2000
    Schlagwörter: Chip-Größen-Kapselung

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archiv | 2000
    Schlagwörter: Flip-Chip-Verkapselung

    Encapsulated aluminium pigments

    Kiehl, A. / Greiwe, K. | Tema Archiv | 1999
    Schlagwörter: Verkapseln

    3-layered 3D flex based MCM: electrical characterization and reliability issues

    Morrison, W.B. / Railkar, T.A. / Malshe, A.P. et al. | Tema Archiv | 1999
    Schlagwörter: Wärmehaushalt (Kapselung)

    Spherical particles for automotive powder coatings

    Satoh, H. / Harada, Y. / Libke, S. | Tema Archiv | 1998
    Schlagwörter: Verkapseln

    Optimal sizing of powder handling horizontal capsule pipelines

    Agarwal, V.C. / Rakesh Mishra | Tema Archiv | 1998
    Schlagwörter: Verkapseln

    Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit

    Joly, J. / Lambert, D. / Ansorge, F. et al. | Tema Archiv | 1998
    Schlagwörter: Verkapseln , Chip-on-board-Kapselung

    Microwave multichip modules using low cost microwave chip on flex packaging technology

    McNulty, M. / Schnell, J. / Nixon, D. | Tema Archiv | 1998
    Schlagwörter: Verkapseln

    Hermetic-equivalent packaging of data accumulator MCM-L modules for general aviation avionics applications

    Conway, C.M. / Hagge, J.K. | Tema Archiv | 1998
    Schlagwörter: Verkapseln

    Microcoil speed position sensor for automotive applications

    Coulon, Y. de / Bourgeois, C. / Lambilly, H. de et al. | Tema Archiv | 1997
    Schlagwörter: Kapselung

    Motorola and MEMMS: the way up to a surface micromachined accelerometer

    Delpoux, A. | Tema Archiv | 1997
    Schlagwörter: Verkapseln

    The application of microtechnology to sensors for the automotive industry

    Smith, G. | Tema Archiv | 1997
    Schlagwörter: Verkapseln

    Long life radioisotopic power sources encapsulated in platinum metal alloys

    Franco-Ferreira, E.A. / Goodwin, G.M. / George, T.G. et al. | Tema Archiv | 1997
    Schlagwörter: Einkapselung

    Simulation of modular mechatronic systems with application to vehicle dynamics

    Rükgauer, A. / Schiehlen, W. | Tema Archiv | 1997
    Schlagwörter: Verkapseln

    Flip chip technology for multi chip modules

    Jung, E. / Aschenbrenner, R. / Busse, E. et al. | Tema Archiv | 1997
    Schlagwörter: keramische Kapselung

    Der Weg zum leisen Fahrzeug

    Leinfellner, H. / Sommer, D. / Leiter, K. | Tema Archiv | 1996
    Schlagwörter: Kapselung

    Source characterization of the lower front-end of a diesel engine

    Johansson, Ö. / Agren, A. / Sundbäck, U. et al. | Tema Archiv | 1996
    Schlagwörter: Kapselung

    On the isolation of science payloads from spacecraft vibrations

    Belvin, W.K. / Sparks, D.W. / Horta, L.G. et al. | Tema Archiv | 1995
    Schlagwörter: Kapselung