Synonyme wurden verwendet für: encapsulation
Suche ohne Synonyme: keywords:(encapsulation)

1–50 von 54 Ergebnissen
|

    A Critical Review on Assessment of Self Healing Performance of Bioconcrete

    Soda, Prabhath Ranjan Kumar / Mini, K. M. | Springer Verlag | 2023
    Schlagwörter: Encapsulation procedure

    A numerical investigation of thermal engine encapsulation concept for a passenger vehicle and its effect on fuel consumption

    Minovski, Blago / Andrić, Jelena / Löfdahl, Lennart et al. | SAGE Publications | 2019
    Schlagwörter: Engine encapsulation

    Dynamic microfactories co-encapsulating osteoblastic and adipose-derived stromal cells for the biofabrication of bone units

    Freier Zugriff
    Nadine, Sara / Patrício, Sónia G. / Correia, Clara R. et al. | BASE | 2019
    Schlagwörter: Cell Encapsulation

    UV‐induced degradation of PERC solar modules with UV‐transparent encapsulation materials

    Witteck, Robert | Online Contents | 2017
    Schlagwörter: encapsulation materials

    NEW PRODUCTS

    Online Contents | 2017
    Schlagwörter: Encapsulation

    PV degradation curves: non‐linearities and failure modes

    Jordan, Dirk C | Online Contents | 2017
    Schlagwörter: Encapsulation

    Adhesion and debonding kinetics of photovoltaic encapsulation in moist environments

    Novoa, Fernando D | Online Contents | 2016
    Schlagwörter: encapsulation debonding

    Development and application of microcapsule for cement hydration control

    Choi, Young Cheol / Cho, Young Keun / Shin, Kyung-Jun et al. | Springer Verlag | 2016
    Schlagwörter: encapsulation

      Development and application of microcapsule for cement hydration control

      Choi, Young Cheol / Cho, Young Keun / Shin, Kyung-Jun et al. | Online Contents | 2016
      Schlagwörter: encapsulation

    Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests

    Corazza, Michael / Krebs, Frederik C. / Gevorgyan, Suren A. | Tema Archiv | 2014
    Schlagwörter: Verkapseln

    Development and testing of bio-inspired microelectromechanical pressure sensor arrays for increased situational awareness for marine vehicles

    Dusek, J. / Kottapalli, A.G.P. / Woo, M.E. et al. | Tema Archiv | 2013
    Schlagwörter: Einkapselung

    Heat transfer and thermal management of electric vehicle batteries with phase change materials

    Ramandi, M.Y. / Dincer, I. / Naterer, G.F. | Tema Archiv | 2011
    Schlagwörter: Kapselung

    Stability of spore-based biosensing systems under extreme conditions

    Sangal, Abhishek / Pasini, Patrizia / Daunert, Sylvia | Tema Archiv | 2011
    Schlagwörter: Kapselung

    New method to determine the range of DVB-H networks and the influence of MPE-FEC rate and modulation scheme

    Plets, David / Joseph, Wout / Verloock, Leen et al. | Tema Archiv | 2009
    Schlagwörter: MPE (multiprotocol encapsulation)

    Metal-enclosed, air-insulated traction switchgear - developments and applications

    Lönard, Detlef / Northe, Jens | Tema Archiv | 2006
    Schlagwörter: Kapselung

    Thermal management of Li-ion battery with phase change material for electric scooters: experimental validation

    Khateeb, S.A. / Amiruddin, S. / Farid, M. et al. | Tema Archiv | 2005
    Schlagwörter: Wärmehaushalt (Kapselung)

    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archiv | 2005
    Schlagwörter: Verkapseln

    The changing automotive environment: high-temperature electronics

    Johnson, R.W. / Evans, J.L. / Jacobsen, P. et al. | Tema Archiv | 2004
    Schlagwörter: Wärmehaushalt (Kapselung)

    Prediction of thermal performance of wire-bonded plastic ball grid array package for underhood automotive applications

    Ramakrishna, K. / Trent, J.R. | Tema Archiv | 2003
    Schlagwörter: Wärmehaushalt (Kapselung)

    Heavy-ion single-event effects testing of lead-on-chip assembled high-density memories

    Harboe-Sorensen, R. / Guerre, F.X. / Loquet, J.G. et al. | Tema Archiv | 2003
    Schlagwörter: Chip-Größen-Kapselung

    Titanium armor applications in combat vehicles

    Montgomery, J.S. / Wells, M.G.H. | Tema Archiv | 2001
    Schlagwörter: Verkapseln

    Optimized cooling systems for high-power semiconductor devices

    Baumann, H. / Heinemeyer, P. / Staiger, W. et al. | Tema Archiv | 2001
    Schlagwörter: Wärmehaushalt (Kapselung)

    Plastic encapsulated components for cars

    Hanreich, G. / Nicolics, J. / Musiejovsky, L. | Tema Archiv | 2001
    Schlagwörter: Wärmehaushalt (Kapselung)

    Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications

    Fabbri, G. / Sartori, C. / Scarano, G. | Tema Archiv | 2001
    Schlagwörter: Chip-on-board-Kapselung

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archiv | 2000
    Schlagwörter: Flip-Chip-Verkapselung

    Encapsulated aluminium pigments

    Kiehl, A. / Greiwe, K. | Tema Archiv | 1999
    Schlagwörter: Verkapseln

    Spherical particles for automotive powder coatings

    Satoh, H. / Harada, Y. / Libke, S. | Tema Archiv | 1998
    Schlagwörter: Verkapseln

    Optimal sizing of powder handling horizontal capsule pipelines

    Agarwal, V.C. / Rakesh Mishra | Tema Archiv | 1998
    Schlagwörter: Verkapseln

    Microcoil speed position sensor for automotive applications

    Coulon, Y. de / Bourgeois, C. / Lambilly, H. de et al. | Tema Archiv | 1997
    Schlagwörter: Kapselung

    Motorola and MEMMS: the way up to a surface micromachined accelerometer

    Delpoux, A. | Tema Archiv | 1997
    Schlagwörter: Verkapseln

    The application of microtechnology to sensors for the automotive industry

    Smith, G. | Tema Archiv | 1997
    Schlagwörter: Verkapseln

    Long life radioisotopic power sources encapsulated in platinum metal alloys

    Franco-Ferreira, E.A. / Goodwin, G.M. / George, T.G. et al. | Tema Archiv | 1997
    Schlagwörter: Einkapselung

    Simulation of modular mechatronic systems with application to vehicle dynamics

    Rükgauer, A. / Schiehlen, W. | Tema Archiv | 1997
    Schlagwörter: Verkapseln

    Source characterization of the lower front-end of a diesel engine

    Johansson, Ö. / Agren, A. / Sundbäck, U. et al. | Tema Archiv | 1996
    Schlagwörter: Kapselung

    Pneumatic capsule pipeline at Akima

    Kennedy, A. | Tema Archiv | 1994
    Schlagwörter: Verkapseln

    An electrostatic accelerator for ultrahypervelocity microprojectiles

    Conte, D. / Turchi, P.J. / Bird, G. et al. | Tema Archiv | 1991
    Schlagwörter: KAPSELUNG

    Silent power transmission systems for modern ships

    Gerstner, J. / Gallin, C. | Tema Archiv | 1990
    Schlagwörter: KAPSELUNG

    Automotive package size driven by market demand

    Mellinger, E.M. / Yuska, P. | Tema Archiv | 1990
    Schlagwörter: KAPSELUNG

    Multichip modules for today's VLSI circuits

    Moravec, T.J. / Jensen, R.J. / Coogan, S.A. et al. | Tema Archiv | 1990
    Schlagwörter: KAPSELUNG

    Noise reduction on trucks of 6 to 10 t gvw through engine encapsulation

    Drewitz, H. / Stiglmaier, M. | Tema Archiv | 1989
    Schlagwörter: KAPSELUNG

    Aerospace packaging defeats hostile environments

    Markstein, H.W. | Tema Archiv | 1988
    Schlagwörter: KAPSELUNG

    Packaging military and commercial electronics

    Markstein, H.W. | Tema Archiv | 1987
    Schlagwörter: KAPSELUNG

    Reliability assessment of codlag system

    Tema Archiv | 1985
    Schlagwörter: VERKAPSELN

    1990's whispering giants

    Mitchell, C. | Tema Archiv | 1985
    Schlagwörter: VERKAPSELN

    Design and characteristics of submarine optical fiber cable

    Ishihara, K. / Kawata, O. / Yoshizawa, N. | Tema Archiv | 1985
    Schlagwörter: DRUCKFESTE KAPSELUNG

    Selecting enclosures for offshore usage

    Deavin, I. | Tema Archiv | 1984
    Schlagwörter: KAPSELUNG