251–300 von 558 Ergebnissen
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    Integration of Environmental Factors in Pre-Layout Design Optimization for Printed Circuit Boards

    Siddhaye, S. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    SMT Compatible No-Flow Underfill for Solder Bumped Flip Chip on Low-Cost Substrates

    Lau, J. H. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Micro-Jet Printing of Polymers and Solder for Electronics Manufacturing

    Hayes, D. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    A Practical Algorithm for Cyclic Hoist Scheduling in a PCB Manufacturing Facility

    Mak, R. W. T. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Vehicle Design and Results for HTS Maglev Model

    Wang, J. R. / Zhang, P. X. / Zhou, L. et al. | British Library Conference Proceedings | 1998
    Verlag: World Scientific , Singapore

    Analysis of Process Errors and Production Yield for Surface Mounted Printed Circuit Assembly

    Linn, R. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Finite Element Modeling of Heat Transfer in Chip on Tape Packages

    Yang, L. Y. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Modeling of Acid Copper Electroplating : A Review

    Poon, G. K. K. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Analysis of Underfill Encapsulation Curing Deformations on Flip Chip on Boaxd (FCOB) Package Reliability

    Pang, J. H. L. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    PCB Assembly Line Setup Optimization Using Component Commonality Matrices

    Dillon, S. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Manufacturing Analysis of Underfill Processing for Low-Cost Flip Chip Assembly

    Baldwin, D. F. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Book Review: Conductive Adhesives in Electronics Packaging (J. Liu)

    Ruf, C. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Laser Removal of Flux Residue Before Chip Attachment to Board in a Flip Chip Assembly

    Lu, J. C. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Hydraulic machinery and cavitation : proceedings of the XIX IAHR Symposium, 9 - 11 September 1998, Singapore / Section on Hydraulic Machinery and Cavitation. Ed.: H. Brekke ... ; Vol. 1

    Symposium on Hydraulic Machinery and Cavitation / International Association for Hydraulic Research, Section on Hydraulic Machinery and Cavitation | TIBKAT | 1998
    Verlag: World Scientific , Singapore [u.a.]

    Hydraulic machinery and cavitation : proceedings of the XIX IAHR Symposium, 9 - 11 September 1998, Singapore / Section on Hydraulic Machinery and Cavitation. Ed.: H. Brekke ... ; Vol. 2

    Symposium on Hydraulic Machinery and Cavitation / International Association for Hydraulic Research, Section on Hydraulic Machinery and Cavitation | TIBKAT | 1998
    Verlag: World Scientific , Singapore [u.a.]

    Spacecraft Doppler Experiments

    Iess, L. / Armstrong, J. W. | British Library Conference Proceedings | 1997
    Verlag: World Scientific

    An Experimental Study of the Self Centering of BGA Packages

    Huang, Y.-W. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Integrated Modeling of Electronics Assembly Systems by Colored Petri Nets

    Tam, H.-Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    An Integrated Rapid Modeling Environment for Managing Wafer Fabrication Facilities

    Souza, R. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    ANALYSIS OF NATURAL RESTING ASPECTS OF COMPLEX PARTS

    Ngoi, B. K. A. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    A continuously variable ER damper with energy generation

    Kim, K.S. / Choi, S.B. / Cheong, C.C. et al. | Tema Archiv | 1997
    Verlag: World Scientific , Singapore

    A DECOMPOSITION METHODOLOGY FOR SCHEDULING SEMICONDUCTOR TEST OPERATIONS FOR NUMBER OF TARDY JOB MEASURES

    Yoo, Wook-Sung | Online Contents | 1997
    Verlag: World Scientific , Singapore

    REWORK OF BGA COMPONENTS

    Chung, C. W. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    The Limits of Automating Electronic Component Rework

    Geren, N. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    On Improving the Performance of Hard Disk Drive Final Assembly via Knowledge Intensive Simulation

    Zhao, Z. Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Hygrothermal Reliability Evaluation of Plastic IC Packages with Computer-Aided Engineering Tools

    Kuo, A.-Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Analyzing the Natural Resting Aspects of Plastic Parts in a Vibratory Bowl Feeder

    Ngoi, B. K. A. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    TECHNOLOGY TRENDS IN ELECTRONICS AND PHOTONICS, THEIR MODELING AND EFFECT ON MANUFACTURING AND ASSEMBLY

    Williams, D. J. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY

    Ramsey, B. J. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Adhesive Flip Chip Bonding on Flexible Substrates

    Aschenbrenner, R. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Thermal Model of a Component Package for System Level Applications

    Teng, S. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Application of Polymer-Thick-Film-Technology (PTF) for Environmentally Friendly Electronic Devices

    Fischer, T. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    An Efficient Assembly Sequencing Heuristic for Printed Circuit Board Configurations

    Moyer, L. K. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Thermal Management for the Robustness Improvement of Double Sided SMT Solder Reflow

    Lee, N. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Comprehensive Review of Natural and Mixed Convection Heat Transfer Models for Circuit Board Arrays

    Teerstra, P. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Adhesive Flip Chip Bonding in a Miniaturized Spectrometer

    Rusanen, O. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime

    Lee, T.-Y. T. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    ENVIRONMENTAL CONCERNS AND RECYCLING/DISASSEMBLY EFFORTS IN THE ELECTRONICS INDUSTRY

    Moyer, Leanne K. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Reliability Testing on Flip Chip Joining with Isotropically-Conductive Adhesives

    Pennanen, V. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    IN SITU STUDY OF SOLDER PASTE BEHAVIOR DURING REFLOW USING THE HOT-STAGE ENVIRONMENTAL SCANNING ELECTRON MICROSCOPE

    Natishan, M. E. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Effects of Gap Height on Conduction within Anisotropic Conducting Adhesive Assemblies

    Mannan, S. H. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Motor vehicle dynamics : modeling and simulation

    Genta, Giancarlo | TIBKAT | 1997
    Verlag: World Scientific , Singapore [u.a.]

    Advances in visual form analysis : proceedings of the Third International Workshop on Visual Form, Capri, Italy, May 28 - 30, 1997

    International Workshop on Visual Form / International Association for Pattern Recognition / Università degli Studi di Napoli, Dipartimento di Informatica e Sistemistica | TIBKAT | 1997
    Verlag: World Scientific , Singapore [u.a.]

    Directional Wave Spectrum and Its Engineering Applications

    Goda, Y. | British Library Online Contents | 1997
    Verlag: WORLD SCIENTIFIC PUBLISHING CO. PTE. LTD.

    Internal Solitary Waves

    Grimshaw, R. | British Library Online Contents | 1997
    Verlag: WORLD SCIENTIFIC PUBLISHING CO. PTE. LTD.