Integration of Environmental Factors in Pre-Layout Design Optimization for Printed Circuit Boards
SMT Compatible No-Flow Underfill for Solder Bumped Flip Chip on Low-Cost Substrates
Micro-Jet Printing of Polymers and Solder for Electronics Manufacturing
A Practical Algorithm for Cyclic Hoist Scheduling in a PCB Manufacturing Facility
Vehicle Design and Results for HTS Maglev Model
Analysis of Process Errors and Production Yield for Surface Mounted Printed Circuit Assembly
Finite Element Modeling of Heat Transfer in Chip on Tape Packages
Modeling of Acid Copper Electroplating : A Review
PCB Assembly Line Setup Optimization Using Component Commonality Matrices
Manufacturing Analysis of Underfill Processing for Low-Cost Flip Chip Assembly
Book Review: Conductive Adhesives in Electronics Packaging (J. Liu)
Laser Removal of Flux Residue Before Chip Attachment to Board in a Flip Chip Assembly
Spacecraft Doppler Experiments
An Experimental Study of the Self Centering of BGA Packages
Integrated Modeling of Electronics Assembly Systems by Colored Petri Nets
An Integrated Rapid Modeling Environment for Managing Wafer Fabrication Facilities
ANALYSIS OF NATURAL RESTING ASPECTS OF COMPLEX PARTS
A continuously variable ER damper with energy generation
The Limits of Automating Electronic Component Rework
On Improving the Performance of Hard Disk Drive Final Assembly via Knowledge Intensive Simulation
Hygrothermal Reliability Evaluation of Plastic IC Packages with Computer-Aided Engineering Tools
Analyzing the Natural Resting Aspects of Plastic Parts in a Vibratory Bowl Feeder
A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY
Adhesive Flip Chip Bonding on Flexible Substrates
Thermal Model of a Component Package for System Level Applications
Application of Polymer-Thick-Film-Technology (PTF) for Environmentally Friendly Electronic Devices
An Efficient Assembly Sequencing Heuristic for Printed Circuit Board Configurations
Thermal Management for the Robustness Improvement of Double Sided SMT Solder Reflow
Comprehensive Review of Natural and Mixed Convection Heat Transfer Models for Circuit Board Arrays
Adhesive Flip Chip Bonding in a Miniaturized Spectrometer
Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime
ENVIRONMENTAL CONCERNS AND RECYCLING/DISASSEMBLY EFFORTS IN THE ELECTRONICS INDUSTRY
Reliability Testing on Flip Chip Joining with Isotropically-Conductive Adhesives
Effects of Gap Height on Conduction within Anisotropic Conducting Adhesive Assemblies
Motor vehicle dynamics : modeling and simulation
Directional Wave Spectrum and Its Engineering Applications