Power und Licht fürs Auto. Verteilte Stromversorgungen im Trend
Trennen, was nicht zusammengehört. AutomotivePackage - ein neuer Ansatz auf IC-Ebene
Chips make light work of driving high-power LEDs
An alternative solution to TPS re-host
Military/civilian mixed-mode Global Positioning System (GPS) receiver (MMGR)
Accelerometer design for vehicle control safety system
The Influence of Knowledge Accumulation on Buyer-Supplier Codevelopment Projects
Perspektiven zu alten und neuen EMV-Problemen
Driving stepper motors at raised environment temperatures
New principle for front light systems in automotive applications
TPMS and RKE operating in the same ISM frequency band
Die Steuerung eines vollvariablen elektromechanischen Ventilbetriebs
UV-visible sensors based on polymorphous silicon
SOI intelligent power IC technology for automotive electronics
Surge protection IC for the switch interface of ECUs
Mcube: an European project to develop a 3D concept to dissipate 30 watts
Ungestörtes Fahrvergnügen? - EMV von Kfz-Elektronik
3D vision systems for active safety
Automated synthesis of SEU tolerant architectures from OO descriptions
Reliability of integrated circuits modified by focused ion beam for space applications
Reliability of MEMS - a methodical approach
0.1 mu m InGaAs/InAlAs/InP HEMT MMICs - a flight qualified technology
Reliable power electronics for automotive applications
Smart rain-light-tunnel sensor
Sensorsignalverarbeitung in der Automobiltechnik - Klassifizierung und Trends
Druck-Sensoren für automobile Anwendungen. Piezoelektronik, kombiniert mit EPROM-Technologie
Aussagekräftige EMV Charakterisierung von Kfz-Halbleitern
Toshiba announces world's first image recognition LSI for intelligent vehicle systems
Mitsubishi Electric Corporation to release ETC on-board equipment
Smart Leistungsschalter für Automobil- und Industrieapplikationen
Pfeilschnell. Systems on Chip für die Automobilelektronik
Bi-directional automotive 42 volt bus to a 14 volt bus DC/DC converter
Communication and supply in automotive 42V PowerNet applications
Interfacing switches and relays to the real world in real time
Accelerated testing of flip chip packages under dynamic load
Cosmic-ray soft error rate characterization of a standard 0.6- mu m CMOS process
Acceptance checking methods for UHF electronic components