Synonyme wurden verwendet für: encapsulation
Suche ohne Synonyme: keywords:(encapsulation)

1–50 von 58 Ergebnissen
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    Engine encapsulation for increased fuel efficiency of road vehicles

    Minovski, Blago / Chalmers tekniska högskola | TIBKAT | 2017
    Schlagwörter: Verkapseln

    Mechanical Properties of Steel Encapsulated Metal Matrix Composites

    Fudger, Sean / Klier, Eric / Karandikar, Prashant et al. | Wiley | 2015
    Schlagwörter: Encapsulation

    Research project for reducing the noise of truck Diesel engines

    Feitzelmayer, K.F. / Schroeder, W. | Tema Archiv | 1979
    Schlagwörter: KAPSELUNG

    Jet Blast Resistance Experiment of Engineered Material Arresting System

    Xiao, Xian-Bo / Kong, Xiang-Jun / Shi, Ya-Jie et al. | Tema Archiv | 2013
    Schlagwörter: Einkapselung

    Some aspects concerning noise reduction on diesel passenger cars

    Charzinski, H.P. / Hiereth, H. | Tema Archiv | 1979
    Schlagwörter: KAPSELUNG

    Comparison and Application of High Prestress and Intensive Support System in Close, Soft and Cracked Roadway Support

    Hu, Bin / Kang, Hong-Pu / Lin, Jian | Tema Archiv | 2012
    Schlagwörter: Einkapselung

    Applications of pre-packaged wheel bearing assemblies

    Carlisle, J.W. | Tema Archiv | 1981
    Schlagwörter: VERKAPSELN

    Titanium armor applications in combat vehicles

    Montgomery, J.S. / Wells, M.G.H. | Tema Archiv | 2001
    Schlagwörter: Verkapseln

    Reliability assessment of codlag system

    Tema Archiv | 1985
    Schlagwörter: VERKAPSELN

    Turnkey processes for window encapsulation

    Zarantonello, A. | Tema Archiv | 1990
    Schlagwörter: VERKAPSELN

    New development of a wet brake system

    Nowak, S. | Tema Archiv | 2002
    Schlagwörter: Verkapseln

    Hydrogen for a global application to road transport

    Rinaldi, P. / Veca, G.M. | Tema Archiv | 2007
    Schlagwörter: Einkapselung

    Multilayer alumina substrates for ECU (automotive electronics)

    Sugai, K. / Matsumoto, H. / Shimojyou, Y. et al. | Tema Archiv | 1998
    Schlagwörter: keramische Kapselung , Wärmehaushalt (Kapselung)

    Silent power transmission systems for modern ships

    Gerstner, J. / Gallin, C. | Tema Archiv | 1990
    Schlagwörter: KAPSELUNG

    Pre-development validation of an engine mounted encapsulation approach on SUV vehicle as 'Eco-Innovation' by means of EU Regulation 725/2011

    Petley, D. / Jansen, W. / Wicksteed, B. et al. | Tema Archiv | 2013
    Schlagwörter: Einkapselung

    1990's whispering giants

    Mitchell, C. | Tema Archiv | 1985
    Schlagwörter: VERKAPSELN

    Development of self-contained hycraulic valve lifter

    Sigiura, A. / Sato, K. / Yamada, K. et al. | Tema Archiv | 1983
    Schlagwörter: KAPSELUNG

    Encapsulated aluminium pigments

    Kiehl, A. / Greiwe, K. | Tema Archiv | 1999
    Schlagwörter: Verkapseln

    A study of chip top delamination in plastic encapsulated packages under temperature loading

    Kravchenko, G. / Bohm, C. | Tema Archiv | 2007
    Schlagwörter: Verkapseln

    Source characterization of the lower front-end of a diesel engine

    Johansson, Ö. / Agren, A. / Sundbäck, U. et al. | Tema Archiv | 1996
    Schlagwörter: Kapselung

    A Novel Technology for Thermal Control for ISP module for Space Applications

    Monti, Riccardo / Barboni, Renato / Gasbarri, Paolo et al. | Tema Archiv | 2010
    Schlagwörter: Wärmehaushalt (Kapselung)

    Acoustic benchmark of different CO2 encapsulation strategies: Application examples and methods for the design of powertrain encapsulations

    Bertolini, C. / Caprioli, D. / Horak, J. et al. | Tema Archiv | 2013
    Schlagwörter: Einkapselung

    Ejection Apparatus

    A. M. Stott | NTIS | 1966
    Schlagwörter: Encapsulation

    Long life radioisotopic power sources encapsulated in platinum metal alloys

    Franco-Ferreira, E.A. / Goodwin, G.M. / George, T.G. et al. | Tema Archiv | 1997
    Schlagwörter: Einkapselung

    Pneumatic capsule pipeline at Akima

    Kennedy, A. | Tema Archiv | 1994
    Schlagwörter: Verkapseln

    Corrosion in integrated electronics

    Greenstein, E. | Tema Archiv | 1978
    Schlagwörter: KAPSELUNG

    P/M titanium reduces aerospace component costs

    Andersen, P.J. / Alber, N.E. / Thellmann, E.L. | Tema Archiv | 1980
    Schlagwörter: VERKAPSELN

    Performance of new silicone adhesives and encapsulants at high and low temperatures

    Mollie, J.P. / Paquet, R.L. | Tema Archiv | 1991
    Schlagwörter: KAPSELUNG

    An 8-Bit 2-gigasample/second A/D converter multichip module for digital receiver demonstration on Navy AN/APS-145 E2-C Airborne Early Warning Aircraft radar

    Thompson, R.L. / Degerstrom, M.J. / Walters, W.L. et al. | Tema Archiv | 1998
    Schlagwörter: Wärmehaushalt (Kapselung)

    TPE-Glasumspritzung von Fahrzeugen, TPE-glass encapsulation

    Creusen, M. | Tema Archiv | 2003
    Schlagwörter: Einkapselung

    Application research on a grinding robot system - grinding of rolling stock parts

    Yoshimi, T. / Jinno, M. / Taguchi, T. et al. | Tema Archiv | 1993
    Schlagwörter: Kapselung

    Spherical particles for automotive powder coatings

    Satoh, H. / Harada, Y. / Libke, S. | Tema Archiv | 1998
    Schlagwörter: Verkapseln

    Microencapsulation of Drugs in the Microgravity Environment of the United States Space Shuttle

    T. R. Tice / R. J. Holl | NTIS | 1991
    Schlagwörter: Encapsulation

    Novel composites for space microelectronics and optics

    Kowbel, W. / Champion, W. / Oliver, P. et al. | Tema Archiv | 2001
    Schlagwörter: Wärmehaushalt (Kapselung)

    Acceleration threshold switches from an additive electroplating MEMS process

    Michaelis, S. / Timme, H.J. / Wycisk, M. et al. | Tema Archiv | 2000
    Schlagwörter: Chip-Größen-Kapselung

    New techniques and thermoplastics for encapsulating automotive sensors and solenoids

    Al-Aseer, M.A. / Neal, G.D. / Patterson, J.F. et al. | Tema Archiv | 1993
    Schlagwörter: Kapselung

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archiv | 2000
    Schlagwörter: Flip-Chip-Verkapselung

    Flip chip technology for multi chip modules

    Jung, E. / Aschenbrenner, R. / Busse, E. et al. | Tema Archiv | 1997
    Schlagwörter: keramische Kapselung

    Evaluation Polyurethane Elastomeric Compound Cps-796-65, Type II

    R. H. Flack | NTIS | 1966
    Schlagwörter: Encapsulation

    Evaluation Polyurethane Elastomeric Compound Uralane 5712, Type III

    R. H. Flack | NTIS | 1966
    Schlagwörter: Encapsulation

    Optimal sizing of powder handling horizontal capsule pipelines

    Agarwal, V.C. / Rakesh Mishra | Tema Archiv | 1998
    Schlagwörter: Verkapseln

    Encapsulation, Electronics, Eccofoam

    F. N. Le Doux | NTIS | 1965
    Schlagwörter: Encapsulation

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archiv | 2001
    Schlagwörter: Chip-Größen-Kapselung

    Submarine Horizontal Launch TACTOM Capsule

    J. C. Callahan | NTIS | 2001
    Schlagwörter: Encapsulation

    Enabling technologies for integrated system-on-a-package for the next generation aerospace applications

    Young, J.J. / Malshe, A.P. / Brown, W.D. et al. | Tema Archiv | 2002
    Schlagwörter: Wärmehaushalt (Kapselung)

    3-layered 3D flex based MCM: electrical characterization and reliability issues

    Morrison, W.B. / Railkar, T.A. / Malshe, A.P. et al. | Tema Archiv | 1999
    Schlagwörter: Wärmehaushalt (Kapselung)