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encapsulation
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Innovative vibro-acoustic metamaterials to provide lightweight NVH solutions
Thesound reduction index applied to automotive problems
Reliability assessment of molded Smart Power Modules
Jet Blast Resistance Experiment of Engineered Material Arresting System
High density packaging for automotive applications
A Novel Technology for Thermal Control for ISP module for Space Applications
Novel component packaging for high current applications using power semiconductor devices
Design limitations of powertrain electronics - automotive EMC challenges
MEMS package in a harsh environment for aeronautic applications
Test method for availability of holes in height - temperature barrier on cementation process
A study of chip top delamination in plastic encapsulated packages under temperature loading
High efficiency, high reliability 2 kW inverter for aeronautical application
Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles
An improved, linear homopolar, electromagnetic launcher: STAR
Thermal characterization of a mercury arc lamp for a projection display system
New method for electrothermal simulations: HDTMOS in automotive applications
Maximizing lumen output of LEDs for automotive exterior signal lighting applications
TPE-Glasumspritzung von Fahrzeugen, TPE-glass encapsulation
High temperature, high power density packaging for automotive applications
Model for BGA and CSP reliability in automotive underhood applications
Thermal management of military fighter aircraft electro-optics pod: an invited paper
Novel composites for space microelectronics and optics
Accelerated testing of flip chip packages under dynamic load
Assessment of high-heat-flux thermal management schemes
Thermal management for high performance computing in spaceborne applications
Variable emissivity through MEMS technology
Acceleration threshold switches from an additive electroplating MEMS process
Memory chip packaging-an enabling technology for high-performance recce systems
3-layered 3D flex based MCM: electrical characterization and reliability issues
Multilayer alumina substrates for ECU (automotive electronics)
Microwave multichip modules using low cost microwave chip on flex packaging technology
Reduction in size and weight of electronic modules through the evolution of packaging design