As the electronics industry moves towards the 21st century, environmentally conscious manufacturing is becoming a very important issue for the industry. In recent years, advanced manufacturing technologies have been developed for automotive electronics packaging that not only are environmentally friendly, but also reduce manufacturing complexity and cost, improve product quality, and meet the stringent reliability requirements for the automotive environment. In this paper, aspects of no-clean soldering and load-free solder development are reviewed, and some of the most critical factors for implementing no-clean soldering and for developing lead-free solders for automotive electronics are outlined.


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    Titel :

    Lead-free and no-clean soldering for automotive electronics


    Weitere Titelangaben:

    Bleifreie und no-clean-Lötverfahren für die Automobilelektronik


    Beteiligte:
    Shangguan, D. (Autor:in) / Gao, G. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    1997


    Format / Umfang :

    4 Seiten, 1 Tabelle, 22 Quellen




    Medientyp :

    Aufsatz (Zeitschrift)


    Format :

    Print


    Sprache :

    Englisch




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