As the electronics industry moves towards the 21st century, environmentally conscious manufacturing is becoming a very important issue for the industry. In recent years, advanced manufacturing technologies have been developed for automotive electronics packaging that not only are environmentally friendly, but also reduce manufacturing complexity and cost, improve product quality, and meet the stringent reliability requirements for the automotive environment. In this paper, aspects of no-clean soldering and load-free solder development are reviewed, and some of the most critical factors for implementing no-clean soldering and for developing lead-free solders for automotive electronics are outlined.
Lead-free and no-clean soldering for automotive electronics
Bleifreie und no-clean-Lötverfahren für die Automobilelektronik
Soldering and Surface Mount Technology ; 9 , 2 ; 5-8
1997
4 Seiten, 1 Tabelle, 22 Quellen
Aufsatz (Zeitschrift)
Englisch
Kraftfahrzeugelektronik , Umweltschutz , Fertigungsverfahren , Kostensenkung , Halbleitergehäuse , Zuverlässigkeit , Löten , Reinigung , Blei , Eutektikum , Zinnlegierung , Silberlegierung , mechanische Eigenschaft , elektrische Eigenschaft , physikalische Eigenschaft , Metallurgie , Flussmittel , Montage
An overview of Lead-Free Soldering for Brazilian Automotive Electronics Applications
British Library Conference Proceedings | 2008
|An overview of Lead-Free Soldering for Brazilian Automotive Electronics Applications
SAE Technical Papers | 2010
|Lead Free Solder for Automotive Electronics
SAE Technical Papers | 1998
|Lead free solder for automotive electronics
Kraftfahrwesen | 1998
|Lead Free Solder for Automotive Electronics
British Library Conference Proceedings | 1998
|