Micro electromechanical Systems (MEMS) resonators have been investigated for over forty years but have never delivered the high performance and low cost required of commercial oscillators. Limiting factors have been temperature drift, long term stability, susceptibility to vibration, manufacturability, and low cost back end packaging. These requirements have now been met by SiTime's MEMS First wafer-level encapsulation technology combined with a system architecture using modern phase lock loop (PLL) technology combined with a high performance CMOS signal conditioning chip with integral temperature sensor to compensate for frequency offset and temperature drift. SiTime's MEMS and CMOS chips are manufactured in state of the art CMOS fabrication facilities and can be packaged with any semiconductor packaging technology such as plastic molding, flip chip, MCM and SIP. The resulting silicon MEMS oscillators outperform existing quartz solutions in various aspects such as reliability, robustness, small size, and system integration; and are suitable for most automotive and commercial applications.
New MEMS timing references for automotive applications
Neuartige MEMS-Zeitreferenzen für den Einsatz im Fahrzeug
2007
11 Seiten, 8 Bilder, 2 Tabellen, 12 Quellen
Aufsatz (Konferenz)
Englisch
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