The main focus at the reliability evaluation was to find out the performance of dice mounted in CoB technology under endurance and electrical conditions, that simulate the qualification stress level for a space mission. The results demonstrated that CoB is a reliable assembly technology. After selecting appropriate stress conditions during the testing, no catastrophic failure throughout the entire evaluation could be generated. The observed degradations were component type dependent. It is therefore recommended to verify the compatibility of the CoB technology on each new part type not covered by existing data. The evaluation however demonstrated on the other hand that the CoB technology is very sensitive regarding thermal aspects, when the technology has to work under high power conditions. Local temperature effects must be considered by the design. New derating requirements must be established for each family of devices. Other aspects, which are also critical in hybrid type of technologies must be considered in the CoB technology as well. For example bonding distribution over active areas and current-driving pads has to be carefully selected for the design of CoB assemblies. Diodes with low forward voltage are an example of this case.
Reliability evaluation of components for the chip on board (CoB) technology in space application
Zuverlässigkeitsbewertung der Komponenten für die Chip-on-board-Technologie (CoB) bei Raumfahrtanwendungen
2002
5 Seiten, 11 Bilder, 1 Tabelle
Aufsatz (Konferenz)
Englisch
Reliability evaluation of components for the Chip on Board (CoB) technology in space application
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