A unified approach has been developed and applied to solder joint life prediction in this paper, which indicates a breakthrough for solder joint reliability simulation. It includes the material characterization of solder alloys, the testing of solder joint specimens, a unified viscoplastic constitutive framework with damage evolution, numerical algorithm development and implementation, and experimental validation. The emphasis of this report focuses on the algorithm development and experimental verification of proposed viscoplasticity with damage evolution.


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    Titel :

    A Unified Approach to Solder Joint Life Prediction


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:
    Shi, Ling (Autor:in) / Liu, Sheng (Autor:in) / Qian, Zhengfang (Autor:in)

    Kongress:

    SAE 2000 World Congress ; 2000



    Erscheinungsdatum :

    2000-03-06




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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