This paper reports an investigation into the effect of low viscosity silicone gel potting on Ball Grid Array (BGA) solder joints and surface mount resistor solder joints showing it to be relative to the hardness of the encapsulant. Failures in BGAs and resistor solder joints negatively affect the reliability of electronic modules in any high temperature environment, especially the automotive underhood environment.The empirical testing shows the effect of the gel hardness on solder joints by continuously monitoring the circuit continuity using an Anatech® Tester during various thermal environmental tests that simulate underhood conditions. The pass/fail criteria used will be two-fold. The first will be actual event failures registered on the Anatech cataloging solder joint failure and the Salt Water Immersion Test proving water intrusion. The second, a more subjective discourse, will concern the visual failures such as bubbles or areas lacking adhesion.


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    Titel :

    Investigation into the Effect of Gel Hardness on Solder Joints


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:
    Naylis, Dan (Autor:in) / Berry, Paul (Autor:in) / Barcley, Tina (Autor:in)

    Kongress:

    SAE 2001 World Congress ; 2001



    Erscheinungsdatum :

    2001-03-05




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch


    Schlagwörter :


    Investigation into the effect of gel hardness on solder joints

    Barcley,T. / Berry,P. / Naylis,D. et al. | Kraftfahrwesen | 2001


    Investigation into the Effect of Gel Hardness on Solder Joints

    Barcley, T. / Berry, P. / Naylis, D. et al. | British Library Conference Proceedings | 2001


    Compound solder joints

    Batista, R. I. / Simonson, R. B. | NTRS | 1976


    Through Hole Solder Joints

    Pierce | Online Contents | 1994


    Stress-relieved solder joints

    Zemenick, C. J. | NTRS | 1980