Mechanical stress on solder joints is reduced by procedure for soldering electronic components to circuit boards. Procedure was developed for radio-frequency (RF) strip-line circuits, for which dimensions must be carefully controlled to minimize parasitic capacitance and inductance. Procedure consists of loosening component from its mounting after each lead is soldered relieving induced stresses before next soldering step.
Stress-relieved solder joints
NASA Tech Briefs ; 4 , 4
01.06.1980
Sonstige
Keine Angabe
Englisch
ETHYLENE TETRAFLUOROETHYLENE MOLDINGS Stress-Relieved
SAE Technical Papers | 1995
Bars Molybdenum, Arc Cast, Stress Relieved
SAE Technical Papers | 1978
ETHYLENE TETRAFLUOROETHYLENE MOLDINGS Stress-Relieved
SAE Technical Papers | 2011
Molybdenum Forgings Arc Cast, Stress Relieved
SAE Technical Papers | 1982
Holographic Stress Analyzer for Solder Joints
NTIS | 1971
|