We have developed a new wafer process for manufacturing micro-structures using Micro Electrical Mechanical Systems (MEMS) technology. Our process combines a single-crystal SOI wafer, vertical Si etching, and back side anisotropic-etching by KOH, and dry release by the plasma etching of SiO2. The sticking of movable structures cannot occur in our process, because no wet treatment is used for release. Our process needs only 4-masks, therefore, it is suitable for mass-production. We have developed ultra-slim acceleration sensor using this process.
Ultra-Slim Automotive Acceleration Sensor Applied MEMS Technology
Sae Technical Papers
SAE 2005 World Congress & Exhibition ; 2005
11.04.2005
Aufsatz (Konferenz)
Englisch
Ultra-slim automotive acceleration sensor applied MEMS technology
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