Modifications of design and fabrication of surface-channel planar Schottky diode (GSC-13063) reduce parasitic capacitances to theoretical minimum, eliminate buried layer of conductive material between anode contact and semi-insulating substrate, and reduce thickness of diode chip. Changes in epitaxial layer structure and additional fabrication steps reduce conversion loss in millimeter and submillimeter mixers.


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    Titel :

    Improved Planar Schottky Diode


    Beteiligte:

    Erschienen in:

    Erscheinungsdatum :

    1991-05-01



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch





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