Improved process for fabrication of integrated circuits developed. Technique utilizes simultaneous ion-beam sputter etching and carbon sputter deposition in conjunction with carbon sputter mask or organic mask decomposed to produce carbon-rich sputter-mask surface. Sputter etching process replenishes sputter mask with carbon to prevent premature mask loss.


    Zugriff

    Zugriff über TIB

    Verfügbarkeit in meiner Bibliothek prüfen


    Exportieren, teilen und zitieren



    Titel :

    Masking Technique for Ion-Beam Sputter Etching


    Beteiligte:
    Banks, B. A. (Autor:in) / Rutledge, S. K. (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    01.05.1986



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :



    Rational unsharp masking technique

    Ramponi, G. / Polesel, A. | British Library Online Contents | 1998



    Silver (Ag) as a novel masking material in glass etching for microfluidics applications

    Lee, H. W. / Bien, D. C. / Badaruddin, S. A. et al. | British Library Online Contents | 2013


    Etching behaviour of sputter-deposited aluminium nitride thin films in H3PO4 and KOH solutions

    Ababneh, A. / Kreher, H. / Schmid, U. | British Library Online Contents | 2008