Metal interconnection pattern deposited on integrated circuit or solar cell economically by thermal decomposition of metallo-organic compound. In proposed process beam from laser or quartz lamp swept over substrate in required metalization pattern; wherever beam impinges on substrate, radiant heat decomposes compound, depositing metal. Process requires less costly equipment and less time than conventional metalization. Process readily adaptable to very-large-scale integrated (VLSI) circuits.


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    Titel :

    Metalization Patterns by Thermal Decomposition


    Beteiligte:

    Erschienen in:

    Erscheinungsdatum :

    1986-01-01



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :


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