In this paper the evolution of silicon based automotive radar for the 76-81 GHz range is described. Starting with SiGe bare-die chips in 2009, today packaged MMICs are available for low-cost radar applications. Future SiGe BiCMOS technology will enable highly integrated single chip radars with superior performance at lower power consumption. This will pave the way for automotive radar safety for everyone and will be an important step towards autonomous driving.


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    Titel :

    SiGe BiCMOS and eWLB packaging technologies for automotive radar solutions


    Beteiligte:
    Bock, J. (Autor:in) / Lachner, R. (Autor:in)


    Erscheinungsdatum :

    01.04.2015


    Format / Umfang :

    857415 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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