For massively parallel interconnects between data processors, or between memory elements and processors, free-space optical techniques have been proposed for some time. In recent years the use of large arrays of vertical-cavity surface-emitting-lasers (VCLEELs) and photodetectors flip-chip bonded to electronic processing or memory chips has gained acceptance as a very promising technique to accomplish the desired interconnects. The flip-chip bonding provides a simple way of incorporating 3-D electrical interconnects to the small contacts of densely arrayed VCSELs and detectors without adding undo capacitance to limit speed or produce crosstalk.


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    Titel :

    Flip-chip bonded VCSELs with integrated microlenses for free-space optical interconnects


    Beteiligte:
    Coldren, L.A. (Autor:in) / Strzelecka, E.M. (Autor:in) / Thibeault, B.J. (Autor:in) / Louderback, D.A. (Autor:in)


    Erscheinungsdatum :

    01.01.1997


    Format / Umfang :

    238257 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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