Laser bars typically have a size of 10/spl times/0.6/spl times/0.1 mm/sup 3/ and an optical output power of more than 10 watt. Commercially these bars are bonded using soft solders like In or eutectic PbSn-solder. Soft solders lead to migration, whiskers at the bond and an increasing of the thermal resistance. Commercial manufactures using such packaging technique only guarantee a lifetime in the range of 5,000 hours. Instead we use a highly reliable and fluxless contact can be achieved by using the eutectic Au(80)Sn(20)-solder.


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    Titel :

    Design and technology for fluxless die bonding of high power laser bars using Au(80)Sn(20)-solder


    Beteiligte:
    Weiss, S. (Autor:in) / Kaulfersch, E. (Autor:in) / Topfer, M. (Autor:in) / Zakel, E. (Autor:in) / Michel, B. (Autor:in) / Reichl, H. (Autor:in)


    Erscheinungsdatum :

    01.01.1997


    Format / Umfang :

    239342 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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