Electronics products are becoming smaller these days. Thus the technology to connect fine pitch electrodes is very important. The authors developed a new soldering method without applying any flux, which deteriorates the insulation property between electrodes. In the ordinary soldering method, flux is used to dissolve the oxide film. In the new method, the authors have introduced alkane to remove oxide film by physical reaction. When heat is applied and alkane is boiled, volume expansion energy breaks the oxide film and the desirable clean solder surface is obtained. As a result, the connections become as strong as using the ordinary method.


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    Titel :

    Fluxless solder joining using alkane


    Weitere Titelangaben:

    Löten ohne Flußmittel mit Alkane


    Beteiligte:
    Miyake, T. (Autor:in) / Kondo, K. (Autor:in) / Ohara, F. (Autor:in) / Okumura, N. (Autor:in)

    Erschienen in:

    JSAE Review ; 22 , 4 ; 571-575


    Erscheinungsdatum :

    2001


    Format / Umfang :

    5 Seiten, 10 Bilder, 1 Tabelle, 2 Quellen




    Medientyp :

    Aufsatz (Zeitschrift)


    Format :

    Print


    Sprache :

    Englisch




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