Fluxless Sn-Ag solder ball formation for flip-chip application [2691-08]
Conference, Optoelectronic packaging ; 1996 ; San Jose; CA
01.01.1996
7 pages
Aufsatz (Konferenz)
Englisch
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
DataCite | 1897
Fluxless solder joining using alkane
Online Contents | 2001
|Fluxless solder joining using alkane
Kraftfahrwesen | 2001
|Fluxless solder joining using alkane
Tema Archiv | 2001
|Flip chip solder bump inspection using vibration analysis
British Library Online Contents | 2012
|