A power electronics converter includes a multi-layer planar carrier substrate, and a converter commutation cell including a power circuit. The power circuit includes at least one power semiconductor switching element, each of which is comprised in a power semiconductor prepackage. Each power semiconductor prepackage includes one or more power semiconductor switching elements embedded in a solid insulating material. A heat sink is arranged to remove heat from the respective power semiconductor prepackage. A thermal interface layer is arranged between a heat removal side of the respective power semiconductor prepackage and the heat sink. The thermal interface layer has a thermal conductivity and a mechanical compressibility. A converter parameter, which is defined as the mechanical compressibility of the thermal interface layer divided by the thermal conductivity of the thermal interface layer, satisfies 0.1 MNK/Wm<Ω<1 GNK/Wm.


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    Titel :

    THERMAL INTERFACE MATERIALS


    Beteiligte:
    WALTRICH UWE (Autor:in) / BUCHERT STANLEY (Autor:in)

    Erscheinungsdatum :

    2023-11-30


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H02K Dynamoelektrische Maschinen , DYNAMO-ELECTRIC MACHINES / B64D Ausrüstung für Flugzeuge , EQUIPMENT FOR FITTING IN OR TO AIRCRAFT / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES



    Thermal interface materials

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