A power electronics converter includes a multi-layer planar carrier substrate, and a converter commutation cell including a power circuit. The power circuit includes at least one power semiconductor switching element, each of which is comprised in a power semiconductor prepackage. Each power semiconductor prepackage includes one or more power semiconductor switching elements embedded in a solid insulating material. A heat sink is arranged to remove heat from the respective power semiconductor prepackage. A thermal interface layer is arranged between a heat removal side of the respective power semiconductor prepackage and the heat sink. The thermal interface layer has a thermal conductivity and a mechanical compressibility. A converter parameter, which is defined as the mechanical compressibility of the thermal interface layer divided by the thermal conductivity of the thermal interface layer, satisfies 0.1 MNK/Wm<Ω<1 GNK/Wm.


    Zugriff

    Download


    Exportieren, teilen und zitieren



    Titel :

    Thermal interface materials


    Beteiligte:
    WALTRICH UWE (Autor:in) / BUCHERT STANLEY (Autor:in)

    Erscheinungsdatum :

    07.11.2023


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Englisch


    Klassifikation :

    IPC:    H02K Dynamoelektrische Maschinen , DYNAMO-ELECTRIC MACHINES / B64D Ausrüstung für Flugzeuge , EQUIPMENT FOR FITTING IN OR TO AIRCRAFT / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen



    THERMAL INTERFACE MATERIALS

    WALTRICH UWE / BUCHERT STANLEY | Europäisches Patentamt | 2023

    Freier Zugriff

    Thermal interface composite polymer materials

    Oleksandr Listratenko / Yuriy Shepetov / Oleksandr Kravchenko et al. | DOAJ | 2025

    Freier Zugriff

    Thermoelectric and Thermal Interface Materials 3

    Thermoelectric and Thermal Interface Materials, Veranstaltung / Electrochemical Society / Electrochemical Society, Electronics and Photonics Division et al. | TIBKAT | 2017


    Thermoelectric and thermal interface materials 2

    Thermoelectric and Thermal Interface Materials, Veranstaltung / Electrochemical Society, Electronics and Photonics Division / Electrochemical Society, High Temperature Materials Division | TIBKAT | 2015


    Silicone Thermal Interface Materials For Automotive Electronics

    Debastiani, Emir / Nascimento, Luis Paulo Finatti / Stephan, Martin | SAE Technical Papers | 2007