Today one of the key issues facing electronic systems designs is heat dissipation. This is even more critical in Automotive Electronics because smaller and lighter modules coupled with higher component density lead to increased necessity of thermal power dissipation. Electronic modules with greater functionality and power also generate more heat. Higher temperatures can directly affect the performance and reliability of these modules. The unique properties of silicone thermal interface materials - in the form of adhesives, gels, encapsulants, gap fillers and thermal pads - can help automotive engineers get increased heat dissipation with higher levels of flexibility and better physical and electrical performance.


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    Titel :

    Silicone Thermal Interface Materials For Automotive Electronics


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    SAE Brasil 2007 Congress and Exhibit ; 2007



    Erscheinungsdatum :

    28.11.2007




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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