Heat dissipation is one of the key issues facing automotive engineers, as performance, reliability and longevity of electronic devices have all been shown to be directly affected by temperature. The current thermal challenges are unprecedented, as smaller engine compartments and higher component density raise under-hood temperatures, while electronic devices with greater functionality and power also generate more heat than previous designs. The unique properties of silicone thermal interface materials can help achieve higher levels of physical and electrical performance in automotive electronics -- facilitating heat dissipation in a variety of forms, including adhesives, gels, encapsulants, gap fillers, fabricated pads and phase change materials.


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    Titel :

    Silicone Thermal Interface Materials for Under-Hood Electronics


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    SAE World Congress & Exhibition ; 2007



    Erscheinungsdatum :

    16.04.2007




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Silicone Thermal Interface Materials for Under-Hood Electronics

    Stephan, M. / Society of Automotive Engineers | British Library Conference Proceedings | 2007


    Silicone thermal interface materials for under-hood electronics

    Stephan,M. / Dow Corning,US | Kraftfahrwesen | 2007


    Silicone Thermal Interface Materials For Automotive Electronics

    Debastiani, Emir / Nascimento, Luis Paulo Finatti / Stephan, Martin | SAE Technical Papers | 2007


    Silicone Thermal Interface Materials For Automotive Electronics

    Nascimento, L.P.F. / Debastiani, E. / Stephan, M. et al. | British Library Conference Proceedings | 2007


    Electronics under the hood

    Stern, M. | Tema Archiv | 1985