An impedance bond of the present invention comprises: a bobbin which has an empty space therein, which has a rectangular parallelepiped shape with a constant thickness, and which is capable of winding a coil; a plate-shaped first coil which has a constant width, thickness, and length, and which has one end to which a first busbar connection terminal is connected and the other end to which a second busbar connection terminal is connected; a plate-shaped second coil which has a constant width, thickness, and length, and which has one end to which a third busbar connection terminal is connected and the other end to which a fourth busbar connection terminal is connected; a primary coil winding body in which a first coil winding body and a second coil winding body are formed as the plate-shaped first coil to which the first and second busbar connection terminals are connected and the plate-shaped second coil to which the third and fourth busbar connection terminals are connected start on the bobbin with a predetermined distance from each other and are wound in a predetermined number of times around the bobbin in a state in which the plate-shaped first and second coils vertically overlap, wherein a neutral point is created by connecting the second busbar connection terminal at the other end of the first coil and the third busbar connection terminal of the second coil of the first and second coil winding bodies, and the resistance of the first coil winding body of the plate-shaped first coil connected to the first busbar connection terminal with respect to the neural point is the same as the resistance of the second coil winding body connected to the fourth busbar connection terminal with respect to the neutral point; a secondary coil winding body which is in contact with a lower surface of the primary coil winding body, and around which a coil is wound according to an electrical proportional relationship with the number of times of a coil wound around the primary coil winding body, wherein a plurality of lead wires are connected and coupled to both ends of the coil; and a silicon iron core formed through the center of the primary coil winding body and the secondary coil winding body. According to the present invention, a method for manufacturing an impedance bond for a railroad track circuit without misoperation can be obtained.

    본 발명의 임피던스본드는, 내면이 빈 공간을 갖고 두께가 일정한 직육면체 형상을 가지며 코일을 감을 수 있는 보빈; 일단에 제1 부스바 연결단자가 접속되어 있고, 타단에 제2부스바 연결단자가 접속되어 있으며 일정한 폭, 두께 및 길이를 갖는 판형 제1코일; 일단에 제3 부스바 연결단자가 접속되어 있고, 타단에 제4부스바 연결단자가 접속되어 있으며 제1코일과 폭, 두께 및 길이가 같은 판형 제2코일; 상기 제1, 2 부스바 연결단자 접속되어 있는 판형 제 1코일, 제3, 4 부스바 연결단자가 접속되어 있는 판형 제2 코일이, 상기 보빈 상에서 일정간격을 두고 출발하여 판형 제1, 2코일이 상하로 겹쳐있는 상태로 보빈을 축으로 일정한 권수로 권취되어 제1 코일권선체, 제2코일권선체가 형성되고, 상기 제1, 2코일권선체의 제 1코일 타단의 제2 부스바 연결단자와 제2 코일의 제3 부스바 연결단자를 접속하여 중성점을 만들어, 중성점을 기준으로 제1 부스바 연결단자와 접속되어 있는 판형 제 1코일의 제1코일권선체와 중성점을 기준으로 제4 부스바 연결단자와 접속되어있는 제2코일권선체 저항이 같은 1차코일권선체; 상기 1차코일권선체 하부면에 접하여, 1차코일권선체의 코일권선 횟수와 전기적인 비례 관계로 코일이 감겨있으면서 코일의 양끝에 다수의 인입선이 연결 결합되어 있는 2차코일권선체; 상기 1차코일권선체, 2차코일권선체 중앙을 관통하여 형성된 규소철심을 갖는다.


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    Titel :

    Method Of Impedance Bond Coiling For Railroad Track Circuit And Impedance Bond Thereof


    Weitere Titelangaben:

    철도용 궤도회로 임피던스본드 권선 권취방법 및 그 권선 권취방법으로 만든 임피던스본드


    Beteiligte:
    LEE KOOK HYUN (Autor:in) / LEE JUNG SU (Autor:in)

    Erscheinungsdatum :

    2023-02-23


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Koreanisch


    Klassifikation :

    IPC:    B61L Leiten des Eisenbahnverkehrs , GUIDING RAILWAY TRAFFIC / H01F MAGNETS , Magnete



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