To provide an autonomous travel device including a heating element such as an electronic apparatus and operating in a high-temperature environment, and equipped with a cooling system that can appropriately cool the inside of the device.SOLUTION: An autonomous travel device includes: a housing 1 provided inside with a heat shield/heat insulation structure in which a heating element x such as an electronic apparatus is housed; a vaporization heat cooling mechanism 2 configured to perform vaporization heat cooling on the housing 1; and a cooling system including a cooling pack 3 filled with a phase-change material that absorbs heat at phase transition and that is disposed in the housing 1. Cooling effects to operate three kinds of means of the housing 1, the vaporization heat cooling mechanism 2, and the cooling pack 3 in conjunction with one another and complement one another are obtained, and thus the inside of the device can be appropriately cooled and can be prevented from being damaged by heat from an electronic apparatus or the like.SELECTED DRAWING: Figure 1

    【課題】電子機器などの発熱体を備え、高温環境下で稼動する自律走行装置であって、装置内部を適切に冷却することができる冷却システムを備えた自律走行装置を提供する。【解決手段】内部に電子機器などの発熱体xが収容される遮熱・断熱構造を有する筐体1と、この筐体1を気化熱冷却する気化熱冷却機構2と、相変化により吸熱を行う相変化物質が充填され、筐体1内部に設置される保冷パック3を有する冷却システムを備える。筐体1、気化熱冷却機構2及び保冷パック3という3つの手段が共働し且つ互いを補完するような冷却作用が得られるため、装置内部を適切に冷却することができ、電子機器などの熱による破損を防止することができる。【選択図】図1


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    Titel :

    AUTONOMOUS TRAVEL DEVICE EQUIPPED WITH COOLING SYSTEM


    Weitere Titelangaben:

    冷却システムを備えた自律走行装置


    Beteiligte:
    FUKUCHI RYOTA (Autor:in) / TAKAGI YUKI (Autor:in) / YOTSUTSUJI JUNICHI (Autor:in)

    Erscheinungsdatum :

    2020-10-01


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Japanisch


    Klassifikation :

    IPC:    B62D MOTOR VEHICLES , Motorfahrzeuge / F28D Wärmetauscher, soweit in keiner anderen Unterklasse vorgesehen, in denen die Wärmetauschmittel nicht in direkte Berührung miteinander kommen , HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES