The invention relates to the technical field of mechanical manufacturing, and discloses a multi-stage lifting mechanism for a semiconductor wafer transmission system, which comprises a plurality of lifting units which are sequentially connected in series from top to bottom, each lifting unit comprises a driving mechanism, the driving mechanism adopts a synchronous belt transmission structure, one end of the driving mechanism is connected with a first-stage lifting mechanism, and the other end of the driving mechanism is connected with a second-stage lifting mechanism. The driving mechanism is used for driving the first-stage lifting mechanism and the second-stage lifting mechanism to move up and down at the same time, so that the whole second-stage lifting mechanism is driven to move up and down along the first-stage lifting mechanism, and then the lifting unit at the upper end of every two adjacent lifting units is driven to move up and down along the second-stage lifting mechanism. The whole device is simple in structure, easy to assemble, low in maintenance difficulty and convenient to popularize and apply.
本发明涉及机械制造的技术领域,公开了一种用于半导体晶圆传输系统的多级升降机构,包括上下依次串联的多个升降单元,每个所述升降单元均包括驱动机构,所述驱动机构采用同步带传动结构,其一端与一级升降机构相连,另一端与二级升降机构相连,所述驱动机构用于同时带动一级升降机构、二级升降机构上下运动,从而带动整个二级升降机构沿一级升降机构上下运动,进而带动相邻两个升降单元中上端的升降单元沿二级升降机构上下运动。整个装置结构简单,组装简单,维护难度低,便于推广应用。
Multistage lifting mechanism for semiconductor wafer transmission system
一种用于半导体晶圆传输系统的多级升降机构
2022-05-06
Patent
Elektronische Ressource
Chinesisch
IPC: | B66F HOISTING, LIFTING, HAULING, OR PUSHING, NOT OTHERWISE PROVIDED FOR, e.g. DEVICES WHICH APPLY A LIFTING OR PUSHING FORCE DIRECTLY TO THE SURFACE OF A LOAD , Hub-, Verhol- oder Schubvorrichtungen, soweit nicht anderweitig vorgesehen, z.B. Vorrichtungen mit unmittelbarer Krafteinwirkung auf die Last / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES |
Multistage tubular lifting mechanism capable of being energized internally
Europäisches Patentamt | 2021
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