Correction to "A Three Dimensional High-Throughput Architecture Using Through-Wafer Optical Interconnect"
JOURNAL OF LIGHTWAVE TECHNOLOGY LT ; 13 , 9 ; 1935
01.01.1995
1935 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC: | 621.3692 |
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
A Three-Dimensional High-Throughput Architecture Using Through-Wafer Optical Interconnect
British Library Online Contents | 1995
|British Library Online Contents | 2015
|Reliability study of hermetic wafer level MEMS packaging with through-wafer interconnect
British Library Online Contents | 2009
|Three-dimensional through-wafer fan-out optical interconnects [3952-42]
British Library Conference Proceedings | 2000
|Three-dimensional through-wafer fan-out optical interconnects [3952-42]
British Library Conference Proceedings | 2000
|