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KAPSELUNG
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Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests
Stability of spore-based biosensing systems under extreme conditions
Reliability potential of epoxy based encapsulants for automotive applications
The changing automotive environment: high-temperature electronics
Model for BGA and CSP reliability in automotive underhood applications
Accelerated testing of flip chip packages under dynamic load
Variable emissivity through MEMS technology
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
3-layered 3D flex based MCM: electrical characterization and reliability issues
Multilayer alumina substrates for ECU (automotive electronics)
Teure aber unverzichtbare Helfer. Explosionsgeschützte Gabelstapler
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications