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Thermal management for high performance computing in spaceborne applications
Acceleration threshold switches from an additive electroplating MEMS process
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
3-layered 3D flex based MCM: electrical characterization and reliability issues
Multilayer alumina substrates for ECU (automotive electronics)
Optimal sizing of powder handling horizontal capsule pipelines
Microwave multichip modules using low cost microwave chip on flex packaging technology
Long life radioisotopic power sources encapsulated in platinum metal alloys