1–5 of 5 hits
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    MCM-L technology: a systems cost analysis for a high volume automotive electronics application

    Evans, J.L. / Bosley, L.E. / Romanczuk, C. et al. | Tema Archive | 1994
    Cost concerns related to the development and manufacturability of multichip modules have limited the widespread use of MCMs for high-volume ...

    Thick film silver multilayers for under-the-hood automative applications

    Aday, J. / Johnson, R.W. / Evans, J.L. et al. | Tema Archive | 1993
    Thick film silver conductor provide a cost effective approach for the fabrication of automotive hybrids. Two prototype, underhood ...

    Using MCM-L technology for under-the-hood automotive environmental conditions

    Evans, J.L. / Romanczuk, C. / Johnson, R.W. et al. | Tema Archive | 1993
    in MCM-L manufacturing techniques are providing the increased reliability required to meet higher vehicle standards for quality. These ...

    Finite element analysis of the thermal characteristics of an automotive powertrain controller

    Romanczuk, C.S. / Burcham, S.W. / Evans, J.L. et al. | Tema Archive | 1993
    at various power levels inputs. The powertrain controller evaluated for this program uses a single layered insulated metal substrate for ...

    Using MCM technology to enhance the development of electronic control modules

    Meir, D.S. / Borkowicz, N. / Evans, J.L. et al. | Tema Archive | 1993
    additional usage of MCM technology - the use of MCMs to aid in the software development and vehicle calibration required for electronic control ...