The rapid advancements in MCM-L technology are providing design freedoms previously unavailable to engineers. Material improvements in laminate printed wiring boards, encapsulants and adhesives are allowing MCM-L technology to meet more stringent environmental conditions. Advances in MCM-L manufacturing techniques are providing the increased reliability required to meet higher vehicle standards for quality. These advances are making MCM-L technology more viable for under-the-hood automotive applications. This paper evaluates the use of MCM-L technology for the stringent conditions typically found in today's automotive environment. The product developed for this analysis is an engine controller module located within the engine compartment of the vehicle. MCM-L technology is used to assemble the logic portion of the controller module. A prototype module has been successfully demonstrated in a test car. Reliability tests are underway to evaluate laminate, bonding wire metallurgy and encapsulant materials.


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    Title :

    Using MCM-L technology for under-the-hood automotive environmental conditions


    Additional title:

    Anwendung der MCM-L-Technologie für Umgebungsbedingungen der Autos


    Contributors:
    Evans, J.L. (author) / Romanczuk, C. (author) / Johnson, R.W. (author) / Aday, J. (author)


    Publication date :

    1993


    Size :

    5 Seiten, 2 Bilder, 2 Quellen



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English





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