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PV degradation curves: non‐linearities and failure modes
Accelerated testing of flip chip packages under dynamic load
Integrated Power Amplifier Final Report, Mar. 1964 - Sep. 1965
Direct glassing of silicon space solar cells: approach and manufacturing experiences
3-layered 3D flex based MCM: electrical characterization and reliability issues
Thermal management of military fighter aircraft electro-optics pod: an invited paper
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications
Purchase Description Transformer and Inductors for Use in Air Launched Guided Missiles
A tunable over controlled oscillator for space application based on a thick film hermetic hybrid
NASA Lewis advanced individual pressure vessel (IPV) nickel/hydrogen technology
Microwave multichip modules using low cost microwave chip on flex packaging technology