Synonyms were used for: encapsulation
Search without synonyms: keywords:(encapsulation)

101–122 of 122 hits
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    PV degradation curves: non‐linearities and failure modes

    Jordan, Dirk C | Online Contents | 2017
    Keywords: Encapsulation

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archive | 2001
    Keywords: Chip-Größen-Kapselung

    Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications

    Fabbri, G. / Sartori, C. / Scarano, G. | Tema Archive | 2001
    Keywords: Chip-on-board-Kapselung

    Automotive package size driven by market demand

    Mellinger, E.M. / Yuska, P. | Tema Archive | 1990
    Keywords: KAPSELUNG

    Accelerated testing of flip chip packages under dynamic load

    Rau, I. / Miessner, R. / Liebing, G. et al. | Tema Archive | 2001
    Keywords: Flip-Chip-Verkapselung

    Integrated Power Amplifier Final Report, Mar. 1964 - Sep. 1965

    T. C. New | NTIS | 1965
    Keywords: Encapsulation

    Packaging military and commercial electronics

    Markstein, H.W. | Tema Archive | 1987
    Keywords: KAPSELUNG

    Alvin-120 VDC/28 VDC electrical system

    Hosom, D.S. / Forrester, N.C. / Walden, B.B. | Tema Archive | 1987
    Keywords: KAPSELUNG

    Direct glassing of silicon space solar cells: approach and manufacturing experiences

    Koch, J.W. / White, P.A. | Tema Archive | 1990
    Keywords: KAPSELUNG

    3-layered 3D flex based MCM: electrical characterization and reliability issues

    Morrison, W.B. / Railkar, T.A. / Malshe, A.P. et al. | Tema Archive | 1999
    Keywords: Wärmehaushalt (Kapselung)

    Thermal management of military fighter aircraft electro-optics pod: an invited paper

    Price, D.C. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    Enabling technologies for integrated system-on-a-package for the next generation aerospace applications

    Young, J.J. / Malshe, A.P. / Brown, W.D. et al. | Tema Archive | 2002
    Keywords: Wärmehaushalt (Kapselung)

    A tunable over controlled oscillator for space application based on a thick film hermetic hybrid

    Revel, F. / Monichino, M. | Tema Archive | 1990
    Keywords: KAPSELUNG

    NASA Lewis advanced individual pressure vessel (IPV) nickel/hydrogen technology

    Smithrick, J.J. / Britton, D.L. | Tema Archive | 1994
    Keywords: druckfeste Kapselung

    Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit

    Joly, J. / Lambert, D. / Ansorge, F. et al. | Tema Archive | 1998
    Keywords: Verkapseln , Chip-on-board-Kapselung

    Snap-50/Spur

    D. R. Basel / R. W. Briggs / C. M. Gauthier et al. | NTIS | 1966
    Keywords: Encapsulation

    Microwave multichip modules using low cost microwave chip on flex packaging technology

    McNulty, M. / Schnell, J. / Nixon, D. | Tema Archive | 1998
    Keywords: Verkapseln

    Multichip modules for today's VLSI circuits

    Moravec, T.J. / Jensen, R.J. / Coogan, S.A. et al. | Tema Archive | 1990
    Keywords: KAPSELUNG