Synonyms were used for: encapsulation
Search without synonyms: keywords:(encapsulation)

1–50 of 123 hits
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    3-layered 3D flex based MCM: electrical characterization and reliability issues

    Morrison, W.B. / Railkar, T.A. / Malshe, A.P. et al. | Tema Archive | 1999
    Keywords: Wärmehaushalt (Kapselung)

    300 ampere, 1000 volt hermetic Darlington transistor

    Morozowich, M. | Tema Archive | 1989
    Keywords: DRUCKFESTE KAPSELUNG

    A case history in power generation

    Ley, D.E. | Tema Archive | 1985
    Keywords: KAPSELUNG

    Accelerated testing of flip chip packages under dynamic load

    Rau, I. / Miessner, R. / Liebing, G. et al. | Tema Archive | 2001
    Keywords: Flip-Chip-Verkapselung

    Acceleration threshold switches from an additive electroplating MEMS process

    Michaelis, S. / Timme, H.J. / Wycisk, M. et al. | Tema Archive | 2000
    Keywords: Chip-Größen-Kapselung

    Adhesion and debonding kinetics of photovoltaic encapsulation in moist environments

    Novoa, Fernando D | Online Contents | 2016
    Keywords: encapsulation debonding

    Aerospace packaging defeats hostile environments

    Markstein, H.W. | Tema Archive | 1988
    Keywords: KAPSELUNG

    Alvin-120 VDC/28 VDC electrical system

    Hosom, D.S. / Forrester, N.C. / Walden, B.B. | Tema Archive | 1987
    Keywords: KAPSELUNG

    An 8-Bit 2-gigasample/second A/D converter multichip module for digital receiver demonstration on Navy AN/APS-145 E2-C Airborne Early Warning Aircraft radar

    Thompson, R.L. / Degerstrom, M.J. / Walters, W.L. et al. | Tema Archive | 1998
    Keywords: Wärmehaushalt (Kapselung)

    An improved, linear homopolar, electromagnetic launcher: STAR

    Nunnally, W.C. / Thompson, J.E. / Engel, T.G. et al. | Tema Archive | 2004
    Keywords: Wärmehaushalt (Kapselung)

    A Novel Technology for Thermal Control for ISP module for Space Applications

    Monti, Riccardo / Barboni, Renato / Gasbarri, Paolo et al. | Tema Archive | 2010
    Keywords: Wärmehaushalt (Kapselung)

    A Smart Reconfigurable Multi-sensor Multi-filter Navigation Engine with Modular Architecture Design for Plug-and-Play Navigation

    Atia, M.M. / Givigi, S. / Noureldin, A. et al. | Tema Archive | 2014
    Keywords: Einkapselung

    Assessment of high-heat-flux thermal management schemes

    Mudawar, I. | Tema Archive | 2000
    Keywords: Wärmehaushalt (Kapselung)

    A study of chip top delamination in plastic encapsulated packages under temperature loading

    Kravchenko, G. / Bohm, C. | Tema Archive | 2007
    Keywords: Verkapseln

    A tunable over controlled oscillator for space application based on a thick film hermetic hybrid

    Revel, F. / Monichino, M. | Tema Archive | 1990
    Keywords: KAPSELUNG

    Aufwendiges Tuning für den Ex-Schutz. Flurförderzeuge

    Tema Archive | 1996
    Keywords: Kapselung

    Automotive electronics IC reliability

    Straub, R.J. | Tema Archive | 1990
    Keywords: KAPSELUNG

    Automotive package size driven by market demand

    Mellinger, E.M. / Yuska, P. | Tema Archive | 1990
    Keywords: KAPSELUNG

    Capping technologies for MEMS

    Hausnear, R. / Stahl, H. | Tema Archive | 2010
    Keywords: Einkapselung

    Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications

    Fabbri, G. / Sartori, C. / Scarano, G. | Tema Archive | 2001
    Keywords: Chip-on-board-Kapselung

    Corrosion in integrated electronics

    Greenstein, E. | Tema Archive | 1978
    Keywords: KAPSELUNG

    Definition der Kriterien fuer laermarme Nutzfahrzeuge mit laermrelevanten Zusatzaggregaten - Tankfahrzeuge

    Goesslinghoff, L. / Pauls, H. | Tema Archive | 1986
    Keywords: VERKAPSELN

    Der Einsatz explosionsgeschuetzter Betriebsmittel in der Erdgasaufbereitung

    Gnauk, W. | Tema Archive | 1978
    Keywords: DRUCKFESTE KAPSELUNG

    Design and characteristics of submarine optical fiber cable

    Ishihara, K. / Kawata, O. / Yoshizawa, N. | Tema Archive | 1985
    Keywords: DRUCKFESTE KAPSELUNG

    Design limitations of powertrain electronics - automotive EMC challenges

    Kuvedu-Libla, J.R.K. | Tema Archive | 2009
    Keywords: Wärmehaushalt (Kapselung)

    Design of hardened radar structures

    Mann, R.L. | Tema Archive | 1977
    Keywords: KAPSELUNG

    Direct glassing of silicon space solar cells: approach and manufacturing experiences

    Koch, J.W. / White, P.A. | Tema Archive | 1990
    Keywords: KAPSELUNG

    Druckfest gekapselte Elektromotoren für den Offshore-Einsatz

    Sobel, W. / Osterthun, H. | Tema Archive | 1998
    Keywords: druckfeste Kapselung

    Embedded training: Can it be done with mirrors?

    Darfus, G.H. | Tema Archive | 1986
    Keywords: KAPSELUNG

    Enabling technologies for integrated system-on-a-package for the next generation aerospace applications

    Young, J.J. / Malshe, A.P. / Brown, W.D. et al. | Tema Archive | 2002
    Keywords: Wärmehaushalt (Kapselung)

    Encapsulations for organic devices and their evaluation using calcium corrosion tests

    Free access
    Klumbies, Hannes | TIBKAT | 2014
    Keywords: Verkapseln

    Flip chip technology for multi chip modules

    Jung, E. / Aschenbrenner, R. / Busse, E. et al. | Tema Archive | 1997
    Keywords: keramische Kapselung

    Future developments on submarine cables and systems

    Reinaudo, C. / Libert, J.F. | Tema Archive | 1994
    Keywords: druckfeste Kapselung

    Gehäusekonzepte für Leistungs-MOSFETs und Schottky-Dioden

    Keller, Kevin | Tema Archive | 2011
    Keywords: verbesserte Einkapselung

    Heat transfer and thermal management of electric vehicle batteries with phase change materials

    Ramandi, M.Y. / Dincer, I. / Naterer, G.F. | Tema Archive | 2011
    Keywords: Kapselung

    Heavy-ion single-event effects testing of lead-on-chip assembled high-density memories

    Harboe-Sorensen, R. / Guerre, F.X. / Loquet, J.G. et al. | Tema Archive | 2003
    Keywords: Chip-Größen-Kapselung

    High density packaging for automotive applications

    Sommer, J.P. / Michel, B. / Hofmann, Th et al. | Tema Archive | 2011
    Keywords: Chip-Größen-Kapselung

    High efficiency, high reliability 2 kW inverter for aeronautical application

    Vieillard, S. / Meuret, R. | Tema Archive | 2007
    Keywords: Wärmehaushalt (Kapselung)

    High temperature, high power density packaging for automotive applications

    Gerber, M. / Ferreira, J.A. / Hofsajer, I.W. et al. | Tema Archive | 2003
    Keywords: Wärmehaushalt (Kapselung)

    Improved specific energy Ni-H2 cell

    Miller, L.E. | Tema Archive | 1985
    Keywords: DRUCKFESTE KAPSELUNG

    Incendivity of electrical sparking due to circulating currents in the enclosures of large electrical machines

    Bartels, A.L. / Bradford, M. / Thompson, M.G. | Tema Archive | 1988
    Keywords: DRUCKFESTE KAPSELUNG

    Initial performance of advanced designs for IPV nickel-hydrogen cells

    Smithrick, J.J. | Tema Archive | 1985
    Keywords: DRUCKFESTE KAPSELUNG