Analysis of despatching policies in semiconductor post-test operations
Design and development of a generic PCBA line simulator
Application of ink screening models to solder paste printing in SMT assembly
Implementation of a decision support system for scheduling semiconductor test operations
SMT in Singapore: a window into the challenges and practice
Multichip modules (MCMs) : a review of the status quo
Performance evaluation of dispatching rules for semiconductor testing operations
Conductive adhesives as die-bonding materials for power electric modules
Multiple-criteria robust design of electronic devices
Design and development of a generic ECAD interface
Die-bonding of large-area naked chips
Sub-pixel resolution for low-cost SMT component placement inspection systems
Competing in the electronics industry : benchmarking world-class performers
Joining of displays using thermosetting anisotropically conductive adhesives
Development goals and present status of 3M's adhesive interconnection technology
Properties of anisotropic conductive adhesive pastes for fine-pitch surface mount technology
Debonding of adhesively joined electronic circuits for recycling
Alternative substrates for power electronic circuits : an experimental evaluation
Thermal analysis of IC packages and printed circuit boards
Wire bond parameter optimization study
Solder paste for tomorrow's electronics manufacturing technology
Computer simulation of solder paste flow, part II : Flow out of a stencil aperture
An intelligent decision support environment for PCB assembly
Advanced superfine-pitch technology
Particle identification system for semiconductor manufacturing
The significance of desoldering and resoldering methods in robotic automated rework
Component procurement under demand uncertainty for mainframe subassemblies
Postponement of packaging and product differentiation for lower logistics costs
Portable communications : trends in systems and component technology
Computer simulation of solder paste flow, part I : Dense suspension theory
Singapore : strategic thrusts for competitive success in the electronics industry
The use of electronic speckle pattern interferometry in electronics manufacturing process modelling
Asia's manufacturing industry gearing up for the high-value electronics market
The current status and future of electronics manufacturing in Penang
Analysing the strategic implications of interconnect technologies
Tolerance analysis and synthesis across assemblies : state-of-the-art review
A fuzzy management decision support system for scenario analysis
What are the design and manufacturing couplings for electronics products?
CPS: a productivity tool for component placement in multi-head concurrent operation PCBA machines
A low-cost automated handling system for SPC evaluation of packaging processes
The EPSRC/D & IPG electronics assembly sector workshop
A Decision-Support Tool for Printed Circuit Board Assembly
An Analysis of Dispatching Rules in a Semiconductor Wafer Fabrication Environment
ELECTRICAL CONDUCTION MODELS FOR ISOTROPICALLY CONDUCTIVE ADHESIVES