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Thermal management for high performance computing in spaceborne applications
Variable emissivity through MEMS technology
Acceleration threshold switches from an additive electroplating MEMS process
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
Memory chip packaging-an enabling technology for high-performance recce systems
MECON - eine neuartige Hochspannungs-Steckverbindung für Unterwasser-Anwendungen
3-layered 3D flex based MCM: electrical characterization and reliability issues
Multilayer alumina substrates for ECU (automotive electronics)
Druckfest gekapselte Elektromotoren für den Offshore-Einsatz
Optimal sizing of powder handling horizontal capsule pipelines