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3-layered 3D flex based MCM: electrical characterization and reliability issues
300 ampere, 1000 volt hermetic Darlington transistor
Accelerated testing of flip chip packages under dynamic load
Acceleration threshold switches from an additive electroplating MEMS process
Adhesion and debonding kinetics of photovoltaic encapsulation in moist environments
An Assessment of Small Submarines and Encapsulation of Ballistic Missiles--Phase II Survey
An improved, linear homopolar, electromagnetic launcher: STAR
A Novel Technology for Thermal Control for ISP module for Space Applications
Assessment of high-heat-flux thermal management schemes
A study of chip top delamination in plastic encapsulated packages under temperature loading
A tunable over controlled oscillator for space application based on a thick film hermetic hybrid
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications
Der Einsatz explosionsgeschuetzter Betriebsmittel in der Erdgasaufbereitung
Design and characteristics of submarine optical fiber cable
Design limitations of powertrain electronics - automotive EMC challenges
Direct glassing of silicon space solar cells: approach and manufacturing experiences
Druckfest gekapselte Elektromotoren für den Offshore-Einsatz
Encapsulations for organic devices and their evaluation using calcium corrosion tests
Encapsulations for organic devices and their evaluation using calcium corrosion tests
Future developments on submarine cables and systems
Gehäusekonzepte für Leistungs-MOSFETs und Schottky-Dioden
Heat transfer and thermal management of electric vehicle batteries with phase change materials
Heavy-ion single-event effects testing of lead-on-chip assembled high-density memories
High density packaging for automotive applications
High efficiency, high reliability 2 kW inverter for aeronautical application
High temperature, high power density packaging for automotive applications
Initial performance of advanced designs for IPV nickel-hydrogen cells