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The changing automotive environment: high-temperature electronics
Reliability potential of epoxy based encapsulants for automotive applications
Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles
Metal-enclosed, air-insulated traction switchgear - developments and applications
Test method for availability of holes in height - temperature barrier on cementation process
A study of chip top delamination in plastic encapsulated packages under temperature loading
High efficiency, high reliability 2 kW inverter for aeronautical application
MEMS package in a harsh environment for aeronautic applications
Novel component packaging for high current applications using power semiconductor devices
Design limitations of powertrain electronics - automotive EMC challenges
A Novel Technology for Thermal Control for ISP module for Space Applications
Heat transfer and thermal management of electric vehicle batteries with phase change materials
High density packaging for automotive applications
Stability of spore-based biosensing systems under extreme conditions