Synonyms were used for: encapsulation
Search without synonyms: keywords:(encapsulation)

101–120 of 131 hits
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    The changing automotive environment: high-temperature electronics

    Johnson, R.W. / Evans, J.L. / Jacobsen, P. et al. | Tema Archive | 2004
    Keywords: Wärmehaushalt (Kapselung)

    Thermal management of Li-ion battery with phase change material for electric scooters: experimental validation

    Khateeb, S.A. / Amiruddin, S. / Farid, M. et al. | Tema Archive | 2005
    Keywords: Wärmehaushalt (Kapselung)

    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archive | 2005
    Keywords: Verkapseln

    Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles

    Beckedahl, P. / Tursky, W. / Scheuermann, U. | Tema Archive | 2005
    Keywords: Verkapseln

    Metal-enclosed, air-insulated traction switchgear - developments and applications

    Lönard, Detlef / Northe, Jens | Tema Archive | 2006
    Keywords: Kapselung

    Hydrogen for a global application to road transport

    Rinaldi, P. / Veca, G.M. | Tema Archive | 2007
    Keywords: Einkapselung

    Test method for availability of holes in height - temperature barrier on cementation process

    Valentin Tcenev, I. / Fillipov, F. | Tema Archive | 2007
    Keywords: Wärmehaushalt (Kapselung)

    A study of chip top delamination in plastic encapsulated packages under temperature loading

    Kravchenko, G. / Bohm, C. | Tema Archive | 2007
    Keywords: Verkapseln

    High efficiency, high reliability 2 kW inverter for aeronautical application

    Vieillard, S. / Meuret, R. | Tema Archive | 2007
    Keywords: Wärmehaushalt (Kapselung)

    MEMS package in a harsh environment for aeronautic applications

    Friedberger, Alois / Gradolph, Christian / Klettner, Florian et al. | Tema Archive | 2008
    Keywords: Verkapseln

    Novel component packaging for high current applications using power semiconductor devices

    Weigeber, Volker / Hayes, Montry B. / Campbell, Robert J. et al. | Tema Archive | 2009
    Keywords: verbesserte Einkapselung

    Design limitations of powertrain electronics - automotive EMC challenges

    Kuvedu-Libla, J.R.K. | Tema Archive | 2009
    Keywords: Wärmehaushalt (Kapselung)

    New method to determine the range of DVB-H networks and the influence of MPE-FEC rate and modulation scheme

    Plets, David / Joseph, Wout / Verloock, Leen et al. | Tema Archive | 2009
    Keywords: MPE (multiprotocol encapsulation)

    A Novel Technology for Thermal Control for ISP module for Space Applications

    Monti, Riccardo / Barboni, Renato / Gasbarri, Paolo et al. | Tema Archive | 2010
    Keywords: Wärmehaushalt (Kapselung)

    Capping technologies for MEMS

    Hausnear, R. / Stahl, H. | Tema Archive | 2010
    Keywords: Einkapselung

    Heat transfer and thermal management of electric vehicle batteries with phase change materials

    Ramandi, M.Y. / Dincer, I. / Naterer, G.F. | Tema Archive | 2011
    Keywords: Kapselung

    High density packaging for automotive applications

    Sommer, J.P. / Michel, B. / Hofmann, Th et al. | Tema Archive | 2011
    Keywords: Chip-Größen-Kapselung

    Stability of spore-based biosensing systems under extreme conditions

    Sangal, Abhishek / Pasini, Patrizia / Daunert, Sylvia | Tema Archive | 2011
    Keywords: Kapselung

    Comparison and Application of High Prestress and Intensive Support System in Close, Soft and Cracked Roadway Support

    Hu, Bin / Kang, Hong-Pu / Lin, Jian | Tema Archive | 2012
    Keywords: Einkapselung