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encapsulation
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Mechanical Properties of Steel Encapsulated Metal Matrix Composites
Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests
Reliability potential of epoxy based encapsulants for automotive applications
Multilayer alumina substrates for ECU (automotive electronics)
Stability of spore-based biosensing systems under extreme conditions
A Novel Technology for Thermal Control for ISP module for Space Applications
Variable emissivity through MEMS technology
Long life radioisotopic power sources encapsulated in platinum metal alloys
Specification of EX'e' enclosures for electrical equipment for use in hazardous atmosphaeres
Performance of new silicone adhesives and encapsulants at high and low temperatures
TPE-Glasumspritzung von Fahrzeugen, TPE-glass encapsulation
The changing automotive environment: high-temperature electronics
Novel composites for space microelectronics and optics
New techniques and thermoplastics for encapsulating automotive sensors and solenoids
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits
Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)
Optimal sizing of powder handling horizontal capsule pipelines
Model for BGA and CSP reliability in automotive underhood applications
Accelerated testing of flip chip packages under dynamic load
3-layered 3D flex based MCM: electrical characterization and reliability issues
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications
An electrostatic accelerator for ultrahypervelocity microprojectiles