Solid-state circuits; ISSCC 2012; blick auf die Chips von morgen
Burnt Clay Brick Aggregate for Internal Curing of Concrete under Adverse Curing Conditions
Analysis of chip formation mechanism in turning of AA 7075/SiCp MMCs
Evolvable hardware: toward morphable, adaptive infrastructures of tomorrow
Applied Vertical Bloch Line Storage Technology
Burnt Clay Brick Aggregate for Internal Curing of Concrete under Adverse Curing Conditions
Automatic Character Detection System for IC Test Handler Based on Active Learning SVM
On the design of hybrid DRAM/SRAM memory schemes for fast packet buffers
Metal Cutting - Chip Formation; Cutting in Microstructure
NASA Electrical, Electronic and Electromechanical (EEE) Parts Assurance, An Overview